Performance improvement of alumina/silicone rubber composites by adding 3‐(trimethoxysilyl)propyl methacrylate grafted siloxane copolymer

Abstract

3-(Trimethoxysilyl)propyl methacrylate grafted poly(methylhydrosiloxane-codimethylsiloxane) (MPS-g-PHMS-PDMS) was synthesized by hydrosilylation reaction. MPS-g-PHMS-PDMS was used as a modifier and directly added into silicone rubber compounds. The effect of MPS-g-PHMS-PDMS on the properties of alumina/silicone rubber composites was studied. The addition of MPSg-PHMS-PDMS increased the bound rubber content of alumina/silicone rubber compounds and the crosslink density of alumina/silicone rubber composites, indicating the enhancement of filler-rubber interaction. SEM images indicated that MPS-g-PHMS-PDMS could promote the uniform dispersion of alumina in the composites and decrease the filler-rubber interface defects. The alumina/ MPS-g-PHMS-PDMS/silicone rubber (500/10/90) composite had the thermal conductivity of 1.68 W/(mÁK) and the tensile strength of 3.17 MPa, exhibiting 18.3% and 84.3% enhancement compared with the alumina/silicone rubber (500/100) composite. This work provides an insight for enhancing thermal conductivity and tensile strength of silicone rubber composites at a high filler content.

Copper and graphene work together to construct a three‐dimensional skeleton thermal conductivity network to improve the thermal conductivity of the epoxy resin

“…[6][7][8] Polymer composites have attracted much attention because of their good performance, [9][10][11][12][13] including light weight, easy to process and other advantages, but the thermal conductivity of most polymers themselves is not high, only 0.1-0.3 W m À1 K À1 , which cannot meet the heat dissipation requirements of electronic devices. [14][15][16] Therefore, polymer matrix is usually filled with high thermal conductivity fillers to obtain composite materials with high thermal conductivity, and high thermal conductivity fillers is the most important thing to prepare high thermal conductivity polymer composites. For example, Wu et al 17 prepared a 3D-BN skeleton with a honeycomb structure, which made the thermal conductivity of epoxy resin composites reach 3.3 W m À1 K À1 .…”

Enhanced 3D printed alumina ceramic cores via impregnation

“…Therefore, though the different solutions hardly affected the pore diameter of the sintered ceramics, they could change their pore volume. The reduction in pore volume is of course attributed to the reaction of the silica deriving from the impregnating solutions with alumina, forming a new mullite phase, which has a lower density than alumina 32–37 …”

“…TO can be expressed as CH 3 CH 2 OSi(OCH 2 CH 3 ) 3 , and possesses a large amount of ‐OCH 2 CH 3 moieties 33 . PM can be expressed as H 2 C = C(CH 3 )CO 2 (CH 2 ) 3 Si(OCH 3 ) 3 , and contains complex groups and can also be well attached to the alumina ceramics 34 …”

“…33 PM can be expressed as H 2 C = C(CH 3 )CO 2 (CH 2 ) 3 Si(OCH 3 ) 3 , and contains complex groups and can also be well attached to the alumina ceramics. 34 The pore size and pore size distribution of the ceramics impregnated with different solvents, obtained from mercury porosimetry, is shown in Figure 3.…”

“…The reduction in pore volume is of course attributed to the reaction of the silica deriving from the impregnating solutions with alumina, forming a new mullite phase, which has a lower density than alumina. [32][33][34][35][36][37]…”