2019
DOI: 10.1016/j.apenergy.2019.01.139
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Performance evaluation of a novel thermoelectric module with BiSbTeSe-based material

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Cited by 41 publications
(20 citation statements)
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“…Consequently, the influences of the leg height ( h ), the leg cross‐sectional area ( A ), the height ( h ce ) and thermal conductivity ( λ ce ) of ceramic plates, and the natural convection heat transfer coefficient ( h a ) on the power output and thermal‐to‐electric conversion efficiency are studied in this section. In addition, we found that the load resistance at the highest output power ( R max_P ) is larger than its internal resistance in our previous study 40 . Here, the reasons for this phenomenon and its influencing factors are investigated, taking the TE couple as the research object.…”
Section: Comprehensive Analysis Of a Conventional π‐Type Te Couplementioning
confidence: 78%
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“…Consequently, the influences of the leg height ( h ), the leg cross‐sectional area ( A ), the height ( h ce ) and thermal conductivity ( λ ce ) of ceramic plates, and the natural convection heat transfer coefficient ( h a ) on the power output and thermal‐to‐electric conversion efficiency are studied in this section. In addition, we found that the load resistance at the highest output power ( R max_P ) is larger than its internal resistance in our previous study 40 . Here, the reasons for this phenomenon and its influencing factors are investigated, taking the TE couple as the research object.…”
Section: Comprehensive Analysis Of a Conventional π‐Type Te Couplementioning
confidence: 78%
“…Additionally, TE couples with different TE materials may have different optimum S p / S n values, and four typical materials (Figure S2) are selected for simulation, including BiTe‐based 29 alloys ( T h = 500 K, T c = 300 K), p‐type 30 and n‐type 31 PbTe‐based alloys ( T h = 700 K, T c = 350 K), p‐type 32 and n‐type 33 SiGe‐based alloys ( T h = 1000 K, T c = 500 K), p‐type NbFeSb‐based half‐Heusler alloys, 34 and n‐type CoSb‐based half‐Heusler alloys 35 ( T h = 1000 K, T c = 500 K). Here, the representative data of the Seebeck coefficient, electrical resistivity, and thermal conductivity are selected from the above literature, and these data are obtained by a polynomial fitting method 40,41 . Among these references, some studies only refer to one kind of material; other studies refer to various materials due to the difference in doping concentration and elements, and the better one was adopted in this research.…”
Section: Structural Optimization and Performance Investigation For Thmentioning
confidence: 99%
“…It is well known that TE power is maximized when the external load is slightly higher than the internal resistance of TE systems. 38 Using this concept, power is calculated by a range of external resistance values, and the TE power is reported where the external load resistance matches the internal resistance. In ANSYS numerical model, three-dimensional, 20-node coupling element SOLID226 was used to simulate TEG system, and a general circuit element, CIRCU124, was selected to define the load resistance similar to the reference study.…”
Section: Numerical Simulations For Thermoelectric Energy Conversionmentioning
confidence: 99%
“…Several mathematical models of thermoelectric modules are proposed such as standard simplified models, improved simplified models and complex TE models. 3 Based on the employed models, researchers tend to account 6,15,[17][18][19]31 or neglect 5,8,[12][13][14]29,38,39 the Thomson effect in their investigations. In this regard, the influence of Thomson effect on the present model is also investigated to see the impact of this term on power output of the module.…”
Section: Influence Of Thomson Effect On Performance Of Tegmentioning
confidence: 99%
“…Three dimensional models have also been used to obtain the optimum geometrical characteristics of thermoelectric generators 28,29 . But this application is not very common and most studies utilize the three‐dimensional model for performance evaluations 30,31 . Meng et al 28 established a multi‐physics three‐dimensional model to study the performance of TEG modules and also compared the results with the classic thermal resistance model solutions.…”
Section: Introductionmentioning
confidence: 99%