Performance-cost optimization of a diamond heat spreader

Enhancement of Hotspot Cooling With Diamond Heat Spreader on Cu Microchannel Heat Sink for GaN-on-Si Device

“…CVD diamond, of thermal conductivity five times higher than Cu, can be utilized as the heat spreader for microelectronic cooling [20][21][22][23]. A. Rogacs [24] conducted the numerical simulation to evaluate the thermal effect of the diamond heat spreader for a small heat source. J.P.…”

Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices

“…Rogacs [18] conducted the numerical simulation to evaluate the thermal effect of the diamond heat spreader for a small heat source. In this study, the cooling solution directly attached to the Si test chip has been developed and evaluated for hotspot cooling.…”

Thermal Analysis of AlGaN/GaN HEMTs Using Angular Fourier-Series Expansion

“…The fundamental heat spreading relationships used as physical background for this work are provided by the semi-analytic approach of Ellison [8] where key scalable relationships have been provided. Other authors have described three-dimensional semi-analytic and numerical analyses for semi-infinite heat sinks [24,28,32] and finite heat sinks [31,[33][34][35] below the diamond. In our problem, the substrate is the heat spreader and the heat flow from the active device to the ambient is impeded by additional epilayers with lower thermal conductivity and thermal boundaries disposed between the heat source and the substrate.…”