Performance analysis of GaN‐FINFET for RFIC application with respect to different FinWidth's

Abstract

GaN has become a prevailing semiconductor in case of power and RF applications. The higher ranking material parameters of GaN, like wider band‐gap, the higher breakdown electric field as well as higher electron velocity when compared to materials like Si, SiC, GaAs etc; allow GaN FINFET to reveal potential advantages such as high voltage and high frequency applications. In this work, a comprehensive study on RF and linearity analysis on Heterojunction‐free GaN layer FINFET through visual technology computer‐aided design (TCAD) device simulator is been illustrated. The influence of varying the Finwidth's of the device on numerous RF parameters like drain current, transconductance (gm), output conductance (gd), gate capacitances(Cgd and Cgs), cut‐off frequency (fT) are studied. And also, the impact of varying the Finwidth's of the device on the numerous linearity parameters like gm2, gm3, VIP3, IIP3, 1 dB compression point were also studied. It is been observed that the higher Finwidth value is more worthy for radio frequency integrated circuit (RFIC) applications.