2022
DOI: 10.1021/acs.chemmater.2c01142
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Percolation Process-Mediated Rich Defects in Hole-Doped PbSe with Enhanced Thermoelectric Performance

Abstract: PbSe–SnSe solid solutions have been extensively investigated in the fields of topological physics, optoelectronic conversion, and thermoelectric technology. In this study, we show that minute Sn-doped Pb0.98Na0.02Se behaves quite differently from conventional solid solutions. A dilute amount of Sn dopants induces rich defects (substitutional Sn atoms, interstitial Sn atoms, and cation vacancies) in hole-doped PbSe. Moreover, with growing concentration of Sn, the dominated defect type varies accordingly due to… Show more

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Cited by 12 publications
(15 citation statements)
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“…As discussed in our previous report, when Sn is doped into p-type PbSe in a dilute amount, it triggers the percolation process and induces rich defects, leading to the formation of Sn 4+ and Sn 2+ . 16 The Sn 4+ ion has a smaller size of 0.69 Å than ∼1.07 Å of tetrahedral interstices in PbSe and is easy to enter interstices. 16,31,32 Therefore, an equal amount of Pb vacancies remains.…”
Section: Design Principles Of Defect Structurementioning
confidence: 99%
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“…As discussed in our previous report, when Sn is doped into p-type PbSe in a dilute amount, it triggers the percolation process and induces rich defects, leading to the formation of Sn 4+ and Sn 2+ . 16 The Sn 4+ ion has a smaller size of 0.69 Å than ∼1.07 Å of tetrahedral interstices in PbSe and is easy to enter interstices. 16,31,32 Therefore, an equal amount of Pb vacancies remains.…”
Section: Design Principles Of Defect Structurementioning
confidence: 99%
“…As described in our previous work, the abrupt decrease of κ lat at 673 K in the x = 0 sample results from the dynamic migration of interstitial Sn atoms to Pb vacancies. 16 But in Te-doped samples, a large amount of interstitial Sn atoms were pulled back to Pb sublattice sites. The decline of the population of Sn i +4 in Te-doped samples leads to an extremely unapparent dynamic migration phenomenon at elevated temperatures, which is proved by TEC measurement in Figure S3.…”
Section: Design Principles Of Defect Structurementioning
confidence: 99%
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