2011
DOI: 10.1002/9781118144527.ch7
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PEN Structure Thermal Stress Analysis for Planar‐SOFC Configurations under Practical Temperature Field

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Cited by 2 publications
(3 citation statements)
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“…Conversely, the planar type, despite the inconvenience of the sealing, displays excellent characteristics in terms of the efficiency of the cell (3). In addition, research and development of a planar plate type ceramic fuel cell with a size of approximately 10 cm × 10 cm has been carried out (6)(7)(8)(9) with the aim of achieving commercial viability.…”
Section: Introductionmentioning
confidence: 99%
“…Conversely, the planar type, despite the inconvenience of the sealing, displays excellent characteristics in terms of the efficiency of the cell (3). In addition, research and development of a planar plate type ceramic fuel cell with a size of approximately 10 cm × 10 cm has been carried out (6)(7)(8)(9) with the aim of achieving commercial viability.…”
Section: Introductionmentioning
confidence: 99%
“…This coupled with the mismatch in coefficients of thermal expansion of different SOFC components makes stress analysis an interesting avenue to explore. Recently, few studies have been performed [32][33][34][35][36][37][38] to analyze stress components inside different components of SOFC. Lin et al [32] analyzed effects of clamping load on the thermal stress distribution in a planar SOFC.…”
Section: Introductionmentioning
confidence: 99%
“…Five different compressible loads were applied to investigate effects on stress distribution. Gulfam et al [35] analyzed thermal stress inside PEN region of SOFC for co-flow, counter-flow and cross-flow configurations using commercial software, ABAQUS [39]. Maximum stress inside anode layer was found at high-temperature regions located on the anode-electrolyte interface for all configurations.…”
Section: Introductionmentioning
confidence: 99%