Peak-type charge barriers enabling high surface-insulating performance of epoxy composites

Luo, Zimin; Zhao, Yushun; Bai, Jinhui; Yang, Kang; Xu, Yufan; Liu, Ding; Du, Bin

doi:10.1016/j.compscitech.2022.109706

Cited by 12 publications

(4 citation statements)

References 34 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…If no new electron is injected, then the surface potential will decrease to zero. However, many experimental results show that after a long time without new electron injection, the surface potential still has a certain distance from the ground potential (the value may be 10–50% of the initial potential ,, ). This means that other binding factors enable the surface to capture certain electron and store it for a long time, which many scholars call “deep traps”. ,− Previous studies have shown that electron needs certain energy to cross the barriers of surface bumps and pits, so a rough surface can serve as a macroscopic barrier to capture charge .…”

Section: Resultsmentioning

confidence: 99%

“…The Fermi level difference between the metal and the polymer generates the interfacial space charge . The electron must cross the space charge layer’s built-in electric field (or potential barrier) from the electrode to the polymer (Figure a). In an ideal state, the Schottky barrier height φ B of the copper electrode–polymer interface conforms to the following equation (eq ): …”

Section: Resultsmentioning

confidence: 99%

See 1 more Smart Citation

Superior Surface-Insulated Polymers with Low Leakage Current Enabled by Tailored Coatings Deposited with Colliding Plasma Jets

Zhang,

Yao,

et al. 2023

ACS Appl. Mater. Interfaces

View full text Add to dashboard Cite

Insufficient surface insulation margin is the primary challenge for a 10 kV plus high-voltage semiconductor module. Surface charge accumulation and electric field distortion are the leading causes of surface insulation failure. Power modules restrict leakage loss, so only insulation dielectrics with low surface conductivity can be used. However, low conductivity, accumulated charge dissipation, and distorted electric field optimization have always been contradictory. A potential barrier increase and electron affinity decrease are both less coupled approaches with conductivity, which may have the potential for reducing surface charge accumulation. Here, surface charge accumulation inhibition and local electric field optimization were synchronously realized by tailored coating deposition with colliding plasma jets. This novelty approach leads to a finer interfacial modification of the triple junction and its nearby interfaces. The high-barrier and low-affinity coatings deposited by colliding plasma jets suppress charge injection (electrode–polymer interface) and promote charge dissipation (gas–polymer interface), respectively. At the same time, the small-area semiconductor deposited at the triple junction relieves the distortion of the electric field. In the end, while maintaining a low leakage current, the surface flashover voltages of polytetrafluoroethylene, polyimide, and epoxy packaging polymers are significantly increased by 69.7, 43.2, and 39.6%, respectively. Notably, the normalized leakage loss is less than 3/10,000 of the commercially available SiC module, which vastly differs from the surface insulation improvement strategy that blindly increases surface conductivity. This tailored coating modification strategy provides a new idea for dielectric research. It has reasonable practicability due to fast, cheap, and environmentally friendly colliding plasma jets.

show abstract

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Superior Surface-Insulated Polymers with Low Leakage Current Enabled by Tailored Coatings Deposited with Colliding Plasma Jets

Zhang,

Yao,

et al. 2023

ACS Appl. Mater. Interfaces

View full text Add to dashboard Cite

show abstract

“…Epoxy resin insulation materials, a kind of polar polymer material, have been extensively applied in many electrical equipment such as power electronic packaging, − outdoor insulation, − and power cable , due to the excellent insulation strength, mechanical properties, and processability. The epoxy resin encapsulated products are inevitably invaded by moisture or water during long-term service, leading to the deterioration of the epoxy resin insulation materials.…”

Section: Introductionmentioning

confidence: 99%

Understanding Water Diffusion Behaviors in Epoxy Resin through Molecular Simulations and Experiments

Liu,

Lin,

Zhang

et al. 2024

Langmuir

View full text Add to dashboard Cite

The unclear understanding of the water diffusion behavior posts a big challenge to the manipulation of water absorption properties in epoxy resins. Herein, we investigated the water diffusion behavior and its relationship with molecule structures inside an epoxy resin mainly by the nonequilibrium molecular dynamics and experiments. It is found that at the initial rapid water absorption stage, bound water and free water both contribute, while at the later slow water absorption stage, free water plays a dominant role. The observed evolution of free water and bound water cannot be explained by the traditional Langmuir model. In addition, molecule polarity, free volume, and segment mobility can all influence the water diffusion process. Hence, the epoxy resin with low polarity and high molecular segment mobility is endowed with higher diffusion coefficients. The saturated water absorption content is almost dependent on the polarity. The understanding of how water diffuses and what decides the diffusion process is critical to the rational design of molecule structures for improving the water resistance in epoxy resin.

show abstract

“…Therefore, effective heat dissipation has become essential for advancing integrated circuit (IC) chips. − Generally, a layer of a thermal interface material (TIM) with high thermal conductivity is added along the through-plane direction of the penetration plane between the chip and the heat sink to ensure heat dissipation in IC chips . Epoxy resin (ER) is widely used as a polymer matrix in TIMs because of its excellent mechanical strength, insulation performance, and processing ease. − However, its modest thermal conductivity of only 0.2 W/m K falls short of IC-chip heat–dissipation demands. Therefore, thermally conductive fillers such as Al 2 O 3 , BP, SiC, and BN are generally added to TIMs.…”

Section: Introductionmentioning

confidence: 99%

Implementation of Epoxy Resin Composites Filled with Copper Nanowire-Modified Boron Nitride Nanosheets for Electronic Device Packaging

Shi,

Zhao,

Hou

et al. 2023

ACS Appl. Nano Mater.

Self Cite

View full text Add to dashboard Cite

The introduction of wide-band semiconductor devices has led to the development of electronic components with a high degree of integration and power density. The use of dielectric polymers can guarantee the performance of electronic components while maximizing their operational reliability. However, this polymer performance is often enhanced at the expense of its electrical insulation properties and processability. Herein, we report the synthesis of epoxy resin composites filled with boron nitride nanosheets (BNNSs) functionalized with copper nanowires (Cu NWs). Through encapsulation within a polydopamine coating, Cu NWs and BNNSs exhibit excellent electrical insulation properties and high dispersion, and their 1D and 2D interconnected networks enable effective charge and heat transfer. Hence, these epoxy resin composites showed a thermal conductivity of 1.2 W/m K at a filler loading rate of 26 wt %, marking a staggering 486% increase compared to pure epoxy resin. These composites also showed low dielectric loss, enhanced electrical insulation properties, matched thermal expansion coefficients, and low water absorption. Experimental analyses and simulations indicated that the composites had strong heat dissipation capability, meeting the technical specifications for electronic packaging materials, and are thus expected to find use in electronic device packaging.

show abstract

Peak-type charge barriers enabling high surface-insulating performance of epoxy composites

Cited by 12 publications

References 34 publications

Superior Surface-Insulated Polymers with Low Leakage Current Enabled by Tailored Coatings Deposited with Colliding Plasma Jets

Superior Surface-Insulated Polymers with Low Leakage Current Enabled by Tailored Coatings Deposited with Colliding Plasma Jets

Understanding Water Diffusion Behaviors in Epoxy Resin through Molecular Simulations and Experiments

Implementation of Epoxy Resin Composites Filled with Copper Nanowire-Modified Boron Nitride Nanosheets for Electronic Device Packaging

Contact Info

Product

Resources

About