PD measurements, failure analysis, and control in high‐power IGBT modules

Abstract

Increased voltage blocking capability and the development of packaging technology for IGBTs can enhance the local electric field that may become large enough to increase partial discharges (PDs) within the module. The study presents a survey on (i) simulation the electric field within an IGBT module; (ii) current standards for evaluation of the insulation systems of IGBTs; (iii) PD detection and localisation methods as well as other diagnostic and quality control test methods about IGBTs; and (iv) various methods for PD control in an IGBT module. The survey shows remarkable technical gaps in all four areas. More sophisticated numerical and theoretical techniques are needed to model complicated geometries, e.g. extremely sharp edges of the copper metallisation and protrusions in the substrate, and composite non-linear field grading materials. There is no model to take into account defects in the gel and on the ceramic substrate. IEC 61287-1 cannot sufficiently assess the behaviour of PDs on IGBT module under the actual operating conditions exposing fast rise pulse-width modulation-like voltages. There is no agreement on the exact origin and location of PDs in the module with relying on measured phase-resolved PD patterns. PD control methods using non-linear grading materials are not mature enough.

High power density technologies for large generators and motors for marine applications with focus on electrical insulation challenges

“…Also, such failures in electrical components used in electric vehicles or aircraft that can impact the safety of the passengers are unacceptable. A critical review of the accelerated insulation aging issue under fast, repetitive voltage pulses, identifying technical gaps, and future research needs, has recently been carried out [51] and with a focus on power electronics modules in [52, 53].…”

Insulation Materials and Systems for Power Electronics Modules: A Review Identifying Challenges and Future Research Needs

“…This manuscript critically reviews recent efforts and presents technical gaps and challenges for developing insulation materials and systems for next-generation WBGbased devices for power electronics modules. A thorough and in-depth review of PD measurements, failure analyses, and control in high-power Si-IGBT modules has been done by the second author [6,7]. This paper discusses more recent research that was not reviewed in [6,7].…”

“…A thorough and in-depth review of PD measurements, failure analyses, and control in high-power Si-IGBT modules has been done by the second author [6,7]. This paper discusses more recent research that was not reviewed in [6,7]. Together, these three publications, [6,7] and this paper, cover almost all electrical insulation issues and challenges to power electronics modules.…”

“…This paper discusses more recent research that was not reviewed in [6,7]. Together, these three publications, [6,7] and this paper, cover almost all electrical insulation issues and challenges to power electronics modules. To the best of our knowledge, such a critical review, that also identifies future research needs, has not been reported to date.…”

Electrical Insulation Weaknesses in Wide Bandgap Devices

“…Another survey of the topics discussed in this book chapter can be found in [55] where other papers, as well as other aspects of the documents reviewed in this book chapter, are evaluated. These two publications, [55] and this book chapter, cover together almost all electrical insulation issues in power electronics modules.…”