PCB-Based Cross-Coupled Differential VCOs Using a Novel LC-Tank Comprised of the Chip Inductors

Ikeda, Hikaru; Itoh, Yasushi

doi:10.1587/transele.e101.c.744

Cited by 2 publications

(1 citation statement)

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“…For the most generic simulation capability, full-3D solvers can be used. These tools are capable of simulating any 3D structure and solving for complex coupling, including antenna radiation patterns [19].…”

Section: Resolution Methods and Spatial Approach: Import/export Capabilitiesmentioning

confidence: 99%

A Comparative Analysis of Computer-Aided Design Tools for Complex Power Electronics Systems

et al. 2021

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Companies working on semiconductors must currently assure the customers of not only the performance of the semiconductor device per se, but also its performance when it is implemented in a real board, therefore including the role of parasitic effects. It is therefore very important to evaluate, especially during the design phase, not only the single device, but the complete board and their mutual interactions. This consideration opens a new area of investigation in the field of electronic systems engineering. In the current literature, the problem of a software evaluation of parasitic dynamics and electromagnetic effects on printed boards is addressed from the point of view of researchers. Moreover, it is fundamental to have a complete view of the various tools that could be usefully adopted from the perspective of manufacturers. This is the main motivation of this technical note, which performs a comparative analysis of the most prominent software tools for printed circuit boards’ (PCBs) simulation. The main features, the key aspects, and the limitations of the software packages are analyzed in terms of the industrial design of power electronics devices, in order to ensure efficiency and fastness in the semiconductor market.

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Section: Resolution Methods and Spatial Approach: Import/export Capabilitiesmentioning

confidence: 99%

A Comparative Analysis of Computer-Aided Design Tools for Complex Power Electronics Systems

et al. 2021

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Electrical and mechanical properties of indium‐tin‐oxide films deposited on polymer substrate using organic buffer layer

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et al. 2001

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PCB-Based Cross-Coupled Differential VCOs Using a Novel LC-Tank Comprised of the Chip Inductors

Cited by 2 publications

References 13 publications

A Comparative Analysis of Computer-Aided Design Tools for Complex Power Electronics Systems

A Comparative Analysis of Computer-Aided Design Tools for Complex Power Electronics Systems

Electrical and mechanical properties of indium‐tin‐oxide films deposited on polymer substrate using organic buffer layer

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