2018
DOI: 10.1002/admi.201800499
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PbI2/CH3NH3Cl Mixed Precursor–Induced Micrometer‐Scale Grain Perovskite Film and Room‐Temperature Film Encapsulation toward High Efficiency and Stability of Planar Perovskite Solar Cells

Abstract: transparent conductive substrate, an electron transport layer, a perovskite layer, a hole transport layer, and a metal electrode. Among these parts, the perovskite layer plays a vital role in determining the device performance since it closely relates to light absorption and photocarrier transport. The quality of the perovskite film can be assessed in terms of morphology and electronic properties. A dense perovskite film without pinholes would reduce the shunting paths and carrier recombination between electro… Show more

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Cited by 13 publications
(8 citation statements)
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References 55 publications
(63 reference statements)
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“…2 Graphite-and carbon black-based back electrodes Generally speaking, a PSC is based on a perovskite layer 48,49 sandwiched between an ETM and a HTM. 50,51 The ETM usually consists of TiO 2 or another n-type semiconductor anode, [52][53][54] while the back electrode is deposited on top of the HTM.…”
Section: Federico Bellamentioning
confidence: 99%
“…2 Graphite-and carbon black-based back electrodes Generally speaking, a PSC is based on a perovskite layer 48,49 sandwiched between an ETM and a HTM. 50,51 The ETM usually consists of TiO 2 or another n-type semiconductor anode, [52][53][54] while the back electrode is deposited on top of the HTM.…”
Section: Federico Bellamentioning
confidence: 99%
“…Hybrid perovskite are susceptible to various degradation factors, including moisture, oxygen, heat, electric field, and ultraviolet exposure [11][12][13][14], which are the main causes of instable photovoltaic conversion for PSCs [15]. Many researches have exhibit effective elimination of external factors by encapsulation [16][17][18][19] and interface modification [20], which has improved the stability of the device. However, even if the interface is well modified to block the corrosion of water and oxygen in the external environment, internal degradation stress such as electrical and thermal stress cannot be eliminated, which leads to decomposition of the perovskite [21].…”
Section: Introductionmentioning
confidence: 99%
“…ALD deposited films can also be combined with other films to form a barrier multilayer for enhanced encapsulation properties. , For example, combining the ALD coated alumina film with a hydrophobic surface modification with 1 H ,1 H ,2 H ,2 H -perfluorodecyltrichlorosilane has also been shown to enhance the barrier performance against moisture ingress . In addition to ALD, e-beam evaporation , and RF sputtering have been used for depositing protective inorganic thin films, while plasma enhanced chemical vapor deposition (PECVD) has been used for depositing CF film encapsulation . Air brush coating of hydrophobic zirconia films (several microns thick) was also reported …”
Section: Encapsulation Methods and Materials For Pscsmentioning
confidence: 99%