“…Originally, FIB processing was used for mask repair (Liang et al, 2000), integrated circuit chip repair/modification (Liu et al, 2006), cross-sectional imaging of critical parts of semiconductor devices and sample preparation for transmission electron microscopy (Daniel et al, 1998;Hopman et al, 2008;Jeon et al, 2010). Besides these applications, FIB milling can also be used to assist carbon nanotube growth and manipulation (Hofmann et al, 2005;Deng et al, 2006), pattern magnetic data storage media (Terris et al, 2007) and structure hard-to-etch materials like SiC or LiNbO 3 . In the field of optoelectronics, there have been extensively studies toward utilizing the FIB as a machining tool to fabricate planar micro-optical components with low surface roughness for integrated optical circuits, for example, the end facet mirrors, ring resonators, gratings and photonic crystals (Hopman et al, 2008).…”