Pattern Recognition and Scaling Studies of Copper Electrodeposition on Cu(100) in the Presence of Additives

Abstract

Copper deposition on Cu͑100͒ in acid-sulfate plating solution containing chloride and additives benzotriazole ͑BTA͒ and 3-mercaptopropane sulfonic acid ͑MPSA͒ was studied by atomic force microscopy ͑AFM͒. AFM images were analyzed by pattern recognition and scaling procedures. In the absence of additives, square-pyramidal mounds emerge and increase in height without reaching a steady-state shape. In the presence of MPSA, the fourfold symmetry is visible in the main features. However, pyramidal mounds do not develop. In the presence of BTA, the principal surface features are hemispheroids without distinct fourfold symmetry. Comparison of the scaling and pattern-recognition results for BTA shows that the local and general growth exponents can be identified with the shape and size evolution of characteristic surface features, respectively.

Direct Electrodeposition of Cu2Sb for Lithium-Ion Battery Anodes

“…The film in Figure has a thickness of 32.4 μm as determined by SEM on a cross-sectional image, and shows no signs of discontinuities or pores in a cross-sectional view of the film. Excluding any nucleation time, this corresponds to an average deposition rate of 3.24 μm per minute, compared to an average of 0.72 μm per minute for the deposition of copper from a 0.2 M CuSO 4 solution at a constant current of 10 mA . The rapid growth rate that we observe indicates that the solution parameters or interaction of the metal precursors with the substrate may facilitate the electrodeposition of Cu 2 Sb.…”

Anomalous scaling of iron thin film electrodeposited in a magnetic field

“…The scaling function f(x) is constant for x ) 1, and varies as x b for x ( 1. The normal scaling has been employed to study the effect of additives on quasi-two dimensional growth of the nucleation [13][14][15][16][17]. The fitted values are compared with the predictions of theoretical models to assess the surface growth mechanism.…”

Copper electrodeposition in sulphate solutions in the presence of benzotriazole

“…Among the common additives used for copper electrodeposition in sulphate plating baths is benzotriazole (BTA) [8,[11][12][13][14][15][16][17][18][19][20][21][22][23][24], which is also an effective corrosion inhibitor for copper and its alloys by forming a protective chemisorbed film [25][26][27][28][29][30][31][32][33][34].…”

“…Previous studies have focused on either the influence of BTA on deposit properties during copper electrodeposition [8,[11][12][13][14][15][16][17][18][19][21][22][23][24] or the adsorption of BTA on copper during Cu 2+ reduction [20,21,32,36]. However, none of these studies considered the influence of BTA during pulse plating.…”

“…Although the influence of Cl ) and BTA together on DC copper plating has been studied [20,22,24,36,37], no investigations of their effects during pulse plating have been reported to the best of our knowledge. Consequently, we are also concerned with a comparison of deposit morphology obtained by pulse and DC plating in the presence of the two additives.…”