Pattern organization on Cu(111) in perchlorate solutions

Vasiljević, Nataša; Dimitrov, Nikolay; Sieradzki, Karl

doi:10.1016/j.jelechem.2006.06.013

Cited by 11 publications

(12 citation statements)

References 44 publications

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“…5 The higher resolution image B illustrates the 4 × 4 Moire ´atomic structure typical for Pb upd layer on Cu(111). 25 This suggests smooth transition from Au(111) to Cu(111) crystallographic structure and confirms the finding based upon the voltammetry results discussed earlier in this paragraph.…”

Section: Resultssupporting

confidence: 89%

“…The lack of vacancy clusters deeper than 1 ML (Figure , images A) and the relatively constant surface roughness after growth of 15 Cu layers suggests a “quasi-perfect” layer-by-layer growth mode . The higher resolution image B illustrates the 4 × 4 Moiré atomic structure typical for Pb upd layer on Cu(111) . This suggests smooth transition from Au(111) to Cu(111) crystallographic structure and confirms the finding based upon the voltammetry results discussed earlier in this paragraph.…”

Section: Resultssupporting

confidence: 83%

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Epitaxial Growth of Cu on Au(111) and Ag(111) by Surface Limited Redox ReplacementAn Electrochemical and STM Study

2007

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The growth of ultrathin copper films by surface limited redox replacement is discussed and experimentally illustrated. Cyclic voltammetry, in situ scanning tunneling microscopy (STM), and X-ray diffraction are employed to monitor the two-dimensional growth and characterize the structure of up to 100 monolayers (ML) of Cu on Ag (111) and Au(111) substrates. The growth is carried out by multiple redox replacement of a layer of underpotentially deposited (upd) Pb used as a sacrificial metal. Open-circuit potential monitoring during the replacement reaction is used to control the completion of each deposition event. Anodic film stripping is performed to determine the film thickness and calculate the yield of the employed deposition strategy. The excellent surface quality of an epitaxially grown Cu film is manifested by a distinct Pb upd voltammetry and ascertained by in situ STM showing uniform surface morphology maintained during the entire growth process. High-resolution STM imaging of Pb upd layer deposited on as-grown Cu films reveals a structure identical to Pb on Cu(111). X-ray photoelectron spectroscopy analysis shows no traces of Pb into accordingly deposited Cu films.

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Section: Resultssupporting

confidence: 89%

Section: Resultssupporting

confidence: 83%

Epitaxial Growth of Cu on Au(111) and Ag(111) by Surface Limited Redox ReplacementAn Electrochemical and STM Study

2007

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“…We developed for this system a method that is based on Pb underpotential deposition (UPD). In this method we take advantage of the ability of Pb to form an UPD monolayer on both Ag and Cu. ,,– Given that, a comparison of Pb UPD charge registered prior to and after the PCD process would give us the factor associated with area development in the course of the displacement. While the foundation and details of the development of this method will be presented elsewhere, we show in Figure the stripping of Pb UPD layer from nanoporous Ag films made by PCD with two different anodic current densities resulting in a different deposition and dissolution atomic ratio for Ag and Cu.…”

Section: Resultsmentioning

confidence: 99%

Processing of Nanoporous Ag Layers by Potential-Controlled Displacement (PCD) of Cu

Dimitrov

2008

Langmuir

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A cementation-like process taking place under potential control and introduced in this work as a "potential-controlled displacement" (PCD) is developed as a new method for processing of nanoporous Ag structures with controlled roughness (porosity) length scales. Most of the development work is done in a deoxygenated electrolyte containing 1 x 10(-3) M AgClO(4 )+ 5 x 10(-2) M CuSO(4) + 1 x 10(-1) M HClO(4) using a copper rotating disk electrode at 50 rpm. At this electrolyte concentration, the Ag deposition is under diffusion limitations whereas the Cu dissolution displays a typical Butler-Volmer anodic behavior. Thus, a careful choice of the operational current density enables strict control of the ratio between the dissolving and depositing metals as ascertained independently by atomic absorption spectrometry (AAS). The roughness length scale of the resulting surfaces is controlled by a careful selection of the current density applied. The highest surface area and finest morphology is obtained when the atomic ratio of Ag deposition and Cu dissolution becomes 1:1. Preseeding of uniform Ag clusters on the Cu surface made by pulse plating of Ag along with complementary plating and stripping of Pb monolayer is found to yield finer length scale resulting in up to a 67% higher surface area. An electrochemical technique using as a reference value the charge of an underpotentially deposited Pb layer on a flat Ag surface is used for measuring the real surface area. Scanning electron microscopy (SEM) studies are conducted to examine and characterize the deposit morphology of Ag grown by PCD on Cu substrates.

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“…The UPDs of various metallic ions on the electrode surface are still of great interests in electrochemistry and ECSTM. The effect of anions, organic additives, and the crystalline orientation of electrode surface on the adlayer structure have been intensively investigated. − From the application respect, intensive attention is paid to the systems showing the potential catalytic properties and physical device applications. The latest advances in this topic can be found in several recent reviews …”

Section: Metal Depositionmentioning

confidence: 99%

Electrochemical Scanning Tunneling Microscopy: Adlayer Structure and Reaction at Solid/liquid Interface

Wang

2007

J. Phys. Chem. C

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The adlayer structure and reaction at the solid/liquid interface has been intensively investigated due to its importance in many physical chemistry and life processes. The emergence of electrochemical scanning tunneling microscopy (ECSTM) provides a new opportunity to study this subject at the atomic and molecular level in aqueous solution. This feature article summarizes some of the latest progress in ECSTM application for the understanding of the structure and reactions taking place at the solid/liquid interface. The adsorption of atoms and organic molecules is clearly revealed, and the knowledge of the underlying molecule/substrate and intermolecular reactions governing the adlayer formation on the surface is deduced. In addition, the effect of external stimuli, such as electrode potential and UV light, on the adlayer structure is demonstrated. Finally, the prospects of future development in this exciting field are outlined.

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Pattern organization on Cu(111) in perchlorate solutions

Cited by 11 publications

References 44 publications

Epitaxial Growth of Cu on Au(111) and Ag(111) by Surface Limited Redox ReplacementAn Electrochemical and STM Study

Epitaxial Growth of Cu on Au(111) and Ag(111) by Surface Limited Redox ReplacementAn Electrochemical and STM Study

Processing of Nanoporous Ag Layers by Potential-Controlled Displacement (PCD) of Cu

Electrochemical Scanning Tunneling Microscopy: Adlayer Structure and Reaction at Solid/liquid Interface

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