2022
DOI: 10.3390/en15228746
|View full text |Cite
|
Sign up to set email alerts
|

Passive Cooling Analysis of an Electronic Chipset Using Nanoparticles and Metal-Foam Composite PCM: An Experimental Study

Abstract: Thermal management of electronic components is critical for long-term reliability and continuous operation, as the over-heating of electronic equipment leads to decrement in performance. The novelty of the current experimental study is to investigate the passive cooling of electronic equipment, by using nano-enriched phase change material (NEPCM) with copper foam having porosity of 97%. The phase change material of PT-58 was used with graphene nanoplatelets (GNPs) and magnesium oxide (MgO) nanoparticles (NPs),… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2023
2023
2024
2024

Publication Types

Select...
6

Relationship

1
5

Authors

Journals

citations
Cited by 9 publications
(2 citation statements)
references
References 38 publications
0
1
0
Order By: Relevance
“…To enhance the distribution of nanoparticles within the PCM, the researchers employed probe sonication Model FS 1200N from Henan Chengyi Co., Ltd. (Zhengzhou, China). The synthesis of GNP included with surfactant within A70 PCM was conducted using a two-step procedure, as depicted by researchers Faisal et al [22] in Figure 1. The first phase included melting the PCM, which was achieved by transferring the pure PCM into a beaker and then placing it on a hot plate.…”
Section: Preparation Of Nanocompositesmentioning
confidence: 99%
“…To enhance the distribution of nanoparticles within the PCM, the researchers employed probe sonication Model FS 1200N from Henan Chengyi Co., Ltd. (Zhengzhou, China). The synthesis of GNP included with surfactant within A70 PCM was conducted using a two-step procedure, as depicted by researchers Faisal et al [22] in Figure 1. The first phase included melting the PCM, which was achieved by transferring the pure PCM into a beaker and then placing it on a hot plate.…”
Section: Preparation Of Nanocompositesmentioning
confidence: 99%
“…
The electronic components in modern devices offer high computational capabilities but, in turn, require large power inputs. [1,2] This consequently creates significant challenges for the thermal management of microprocessors. In fact, often the self-heating due to Joule-Lenz law becomes a bottleneck to the performance and reliability of computing units.
…”
mentioning
confidence: 99%