Passivation and corrosion of the metallic high performance materials Alloy 33 and MC-Alloy in different environments

Gildenpfennig, A.; Gramberg, U.; Hohlneicher, Georg

doi:10.1016/s0010-938x(02)00101-4

Cited by 14 publications

(7 citation statements)

References 20 publications

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“…Moreover, nickel is an element included in many alloys to increase their corrosion resistance [4][5][6]. Nickel has been the subject of many electrochemical studies regarding electrodissolution and passivation processes [7][8][9][10][11].…”

Section: Introductionmentioning

confidence: 99%

Electrochemical dissolution and passivation of nickel powder randomly dispersed in a graphite + polypropylene matrix

et al. 2006

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Nickel powder (10% in weight) randomly dispersed in a graphite (40%) + polypropylene (50%) matrix was studied as a composite electrode in a sulphuric-sulphate acid medium by means of voltammetry and Electrochemical Impedance Spectroscopy (EIS). Under voltammetric conditions, this thermoplastic material shows an electrochemical behaviour similar to nickel metal. However, under EIS measurement conditions the electrodissolution behaviour of the nickel powder is partially limited by the diffusion of the anions in the electrolyte in order to electroneutralize the excess of electrogenerated positive charge. The low frequency range of the measured impedance spectra can be interpreted as a parallel arrangement of a capacitive and a Warburg impedance, instead of a CPE element initially considered in the fitting. Values for CPE exponents lower than 0.85 are interpreted as a competition between a capacitive/transport contribution to the overall impedance response.

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Section: Introductionmentioning

confidence: 99%

Electrochemical dissolution and passivation of nickel powder randomly dispersed in a graphite + polypropylene matrix

et al. 2006

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“…The passive films of many metals have semiconductor properties, which can be investigated by capacitance measurements. The charge distribution at the semiconductor/solution is usually determined based on the Mott–Schottky relationship by measuring the electrode capacitance C as a function of the electrode potential E :

\frac{1}{C^{2}} = \pm \frac{2}{e \cdot N \cdot ϵ \cdot ϵ_{0}} true(E - E_{FB} - \frac{k T}{e} true)

where the negative sign is for p ‐type conductivity, the positive sign is for n ‐type conductivity, e is the electron charge, N is the charge carrier density, the electron donor concentration for n ‐type semiconductor or the acceptor concentration for p ‐type semiconductors, ϵ 0 is the vacuum permittivity, ϵ is the relative dielectric constant of the semiconductor, k is Boltzmann's constant, T is the absolute temperature, E is the applied electrode potential, and E FB is the flatband potential. The donor density can be calculated from the slope, and the flatband potential can be determined by extrapolation to C = 0.…”

Section: Resultsmentioning

confidence: 99%

“…The passive films of many metals have semiconductor properties, which can be investigated by capacitance measurements. The charge distribution at the semiconductor/solution is usually determined based on the Mott-Schottky relationship by measuring the electrode capacitance C as a function of the electrode potential E [36][37][38][39][40] :…”

Section: Mott-schottky Analysismentioning

confidence: 99%

Effect of solution annealing on the microstructure evolution and corrosion behavior of 2205 duplex stainless steel

Zhang

Lin

et al. 2018

Materials & Corrosion

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The effects of solution annealing temperature and isothermal time on the phase composition evolution and corrosion behavior were investigated by employing energy dispersive spectrometry, potentiodynamic polarization measurements, electrochemical impedance spectroscopy, and Mott–Schottky analysis. The pit morphologies were observed by a digital VHX‐5000 with a visible 3D microscopy system. The highest corrosion resistance and most stable passive films were obtained for specimen solution annealing at 1075 °C. Additionally, the solution time had a significant influence on the microstructure evolution and corrosion resistance of the duplex stainless steel. The largest impedance values were exhibited, revealing the best stability with a superior corrosion resistance of the films. The depth and size of pits that occurred on austenite were smaller than those on ferrite. The phase proportion on the microstructure and redistribution of the alloying elements caused by duplex interdiffusion solution annealing simultaneously affected the density of defects and the stability of the passive film, which determined the corrosion resistance. However, the semiconductor properties of the passive films were not affected.

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“…It takes part in many alloys thus increasing their corrosion resistance [1][2][3]. This is because nickel has been the subject of many researches related with dissolution and passivation mechanisms in acid and basic medium by means of different electrochemical techniques [4][5][6][7][8][9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

“…(1) and (2) are responsible for metal electrodissolution, whereas Eqs. (3) and (4) are responsible for metal passivation (passive film growth) when the electrode surface is fully covered by a passive film [18,19]. Processes (1), (3) and (6) take place at the metal/film interface, whereas processes (2), (4), (5), and (7) take place at the passive film/solution interface.…”

Section: Introductionmentioning

confidence: 99%

Growth of passive layers on nickel during their voltammetric anodic dissolution in a weakly acid medium

Gregori¹,

Garcı́a-Jareño²,

Giménez-Romero³

et al. 2006

Electrochimica Acta

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Passivation and corrosion of the metallic high performance materials Alloy 33 and MC-Alloy in different environments

Cited by 14 publications

References 20 publications

Electrochemical dissolution and passivation of nickel powder randomly dispersed in a graphite + polypropylene matrix

Electrochemical dissolution and passivation of nickel powder randomly dispersed in a graphite + polypropylene matrix

Effect of solution annealing on the microstructure evolution and corrosion behavior of 2205 duplex stainless steel

Growth of passive layers on nickel during their voltammetric anodic dissolution in a weakly acid medium

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