“…Commonly used adhesive fillers are nonvolatile, organic substances, such as wheat or rye flour, soybean powder, rice husk, wood powder, bark powder or other lignocellulosic wastes, such as palm kernel, coconut shells, starch material, etc. [ 27 , 31 ]. In addition, inorganic materials such as metal powders, metal oxides, and minerals (clay, sepiolite, wollastonite) have also been used as adhesive fillers, typically to improve compression strength and dimensional stability [ 15 , 30 , 33 , 34 ].…”