2010
DOI: 10.1109/tdei.2010.5539704
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Partial discharge control in a power electronic module using high permittivity non-linear dielectrics

Abstract: High electric fields at the edge of the substrate metallization can give rise to partial discharge within power electronic modules and can lead to eventual failure. This paper examines the use of silicone gels filled with barium titanate to reduce the electric field enhancement at the edge of substrate metallization and therefore increase partial discharge inception voltages. The barium titanate filled gel produces a dielectric in which the relative permittivity is increased over a plain gel and that also exhi… Show more

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Cited by 104 publications
(52 citation statements)
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“…The inclusion of barium titanate into the silicone gel does not significantly disturb the curing characteristics of the gel and nor does it significantly affect the adhesive qualities [6]. Before filled silicone gel was poured into the module, the dielectric properties of the composite were tested and analyzed.…”
Section: Resultsmentioning
confidence: 99%
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“…The inclusion of barium titanate into the silicone gel does not significantly disturb the curing characteristics of the gel and nor does it significantly affect the adhesive qualities [6]. Before filled silicone gel was poured into the module, the dielectric properties of the composite were tested and analyzed.…”
Section: Resultsmentioning
confidence: 99%
“…As the barium titanate ceramic powders with 15% volume ratio were evenly mixed with silicone gel, a theoretical permittivity εeff 5.42 of the composite silicone gel was obtained by calculating. The composite silicone gel system is actually tested by bias voltage, and the dielectric constant depends on the variation of the electric field strength as follows [6], (2) Accordingly, as the filled silicone gel is fit in a higher bias field, its dielectric constant also increases.…”
Section: Resultsmentioning
confidence: 99%
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“…The discussed improvements include a coating of the edge (non-linear resistive materials, high-resistive materials, etc. ), 3Dintegration, embedding of the metallization, and stacking of substrates [16][17][18][19][20][21]. Furthermore, the PDIV can be increased by inert fluids instead of potting like silicone gels with the same permittivity and with increased permittivity of the fluids.…”
Section: Introductionmentioning
confidence: 99%
“…RECENTLY the power semiconductor market is growing rapidly and market demands have become harsh, where low price, higher efficiency, compactness, high reliability, and higher operating voltage are required [1,2]. These requirements result in the higher electric field strength within the modules and call for the optimization of insulation designing.…”
Section: Introductionmentioning
confidence: 99%