Partial discharge characteristics of peek utilized in press-pack IGBT under DC voltage
Peng Yang,
Haoyu Liu,
Chenshuo Liu
et al.
Abstract:Modular multilevel converters (MMCs) have been utilized in solid-state transformers (SSTs). With the increasing demand in high-voltage power module in MMC-SST, press-pack IGBTs are very promising. The poly-ether-ether-ketone (PEEK) frame is utilized in the submodules of press-pack IGBT to withstand the high voltage. The electric field simulation in this paper reveals that electric field concentrates on the surface of the PEEK frame. Thus, the surface partial discharge characteristics under direct current (DC) … Show more
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