Abstract:Pin access has become one of the most difficult challenges for detailed routing in advanced technology nodes, for example, in 14nm and below, for which double-patterning lithography has to be used for manufacturing lower metal routing layers with tight pitches, such as M2 and M3. Self-aligned double patterning (SADP) provides better control on line edge roughness and overlay, but it has very restrictive design constraints and prefers regular layout patterns. This article presents a comprehensive pin-access pla… Show more
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