Parametric optimization and characterization of WC–Si–Cu composite layer deposited by electrical discharge coating

Siva Rao, S V V N; Bhavani, T; Kumar, Gautam; Ghosh, S K; Barma, J D; Meitei, R B

doi:10.1007/s12046-023-02333-7

Sādhanā

2023

DOI: 10.1007/s12046-023-02333-7

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Parametric optimization and characterization of WC–Si–Cu composite layer deposited by electrical discharge coating

S V V N Siva Rao,

T Bhavani,

Gautam Kumar

et al.

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2024

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A comparative characterization analysis of electrode materials for optimal deposition on copper by advancing electrical discharge coating

Awarasang,

Hung

2024

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This research explores the efficiency of Electrical Discharge Coating (EDC) as an advanced surface modification technique using powder suspension, conventional electrodes, and 3D printed electrodes (3DPE), focusing on Ti6Al4V alloys. Conventional Ti electrodes resulted in 100% titanium content with a thickness of 110 µm, while the powder suspension coating was inadequate. The use of 3D printed electrodes showed promising results, with uniform deposition of 61.20 µm thickness and enhanced surface properties under 10 A current. Further analysis of 3D printed Ti6Al4V EDC revealed a higher Ti percentage of 44.20%, TiC formation of 84.17%, and enhanced microhardness with lower surface roughness. Thorough optimization of 3D printed electrode EDC has been undertaken. The study suggests the potential replacement of traditional electrodes such as powder metallurgy with 3D printed counterparts, advancing surface modification techniques and opening new avenues for materials engineering and manufacturing processes.

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A comparative characterization analysis of electrode materials for optimal deposition on copper by advancing electrical discharge coating

Awarasang,

Hung

2024

Sci Rep

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Parametric optimization and characterization of WC–Si–Cu composite layer deposited by electrical discharge coating

Cited by 1 publication

References 15 publications

A comparative characterization analysis of electrode materials for optimal deposition on copper by advancing electrical discharge coating

A comparative characterization analysis of electrode materials for optimal deposition on copper by advancing electrical discharge coating

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