Parameter analysis of hot plate in lithography process based on regression orthogonal experiment design

Abstract

In lithography process, wafers need to be baked on the hot plate. There are very high requirement to the temperature uniformity of hot plate surface. To the problem of choosing design parameters, the orthogonal experimental design method was used, the simulation software ANSYS was applied, the design parameters on the various conditions were analyzed, Then a regression model was obtained based these simulation data. It is consistent between the result of regression model and the result of simulation. The regression model indicates a better choice direction of the design parameters of hot plate.