Paralleling 650 V/150 A GaN HEMTs for Cryogenically Cooled Solid-State Circuit Breaker Applications

Yang, Chen-Chung; Zhou, Dong; Dam, Shimul Kumar; Qin, Dehao; Chen, Ruirui; Wang, Fred; Bai, Hua; Zhang, Zheyu

doi:10.1109/apec43580.2023.10131407

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2023 IEEE Applied Power Electronics Conference and Exposition (APEC) 2023

DOI: 10.1109/apec43580.2023.10131407

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Paralleling 650 V/150 A GaN HEMTs for Cryogenically Cooled Solid-State Circuit Breaker Applications

Chen-Chung Yang

Dong Zhou²,

Shimul Kumar Dam

et al.

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Cited by 1 publication

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Hybrid Double-Side Cooled Package for Multichip GaN Power Module With Optimal Current Sharing at High Switching Speed

Li,

Yang,

Yao

et al. 2024

IEEE J. Emerg. Sel. Topics Power Electron.

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Hybrid Double-Side Cooled Package for Multichip GaN Power Module With Optimal Current Sharing at High Switching Speed

Li,

Yang,

Yao

et al. 2024

IEEE J. Emerg. Sel. Topics Power Electron.

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Paralleling 650 V/150 A GaN HEMTs for Cryogenically Cooled Solid-State Circuit Breaker Applications

Cited by 1 publication

References 9 publications

Hybrid Double-Side Cooled Package for Multichip GaN Power Module With Optimal Current Sharing at High Switching Speed

Hybrid Double-Side Cooled Package for Multichip GaN Power Module With Optimal Current Sharing at High Switching Speed

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