Parallel Data Migration Framework on Linux Clusters

Abstract

A rapid growth in the storage capacity requirements at a computer center can lead to the installation of additional disk racks. The challenging task is not the installation, but to migrate old data to the new storage pools. A framework to parallelize the data migration process, using Linux clusters connected to Storage Area Network storage, is presented. A Linux tool to efficiently parallelize data migration, utilizing the High Performance Computing environment, is developed. Results show that using multiple nodes and multiple data copying streams per node achieves significant speedup factors over manual copying. The tool is demonstrated on four nodes using 178 data copying streams, achieving a speedup factor close to seven. The tool is scalable and capable of higher speedup factors with more available data moving nodes.

Superbiphilic Laser‐Microengineered Surfaces with A Self‐Assembled Monolayer Coating for Exceptional Boiling Performance

“…In the region of high heat fluxes at or near CHF (not shown in Figures S11–S13), our data indicates that boiling performance increases up to an A SHPO of 1% (i.e., a04p125 ), after which it again decreases. For example, the average heat transfer coefficient at CHF for samples with a spot size of 0.4 mm increased from 188 kW m −2 K −1 to 282 kW m −2 K −1 when increasing the spot pitch from 0.6 to 1.25 mm, and then decreased to 170 kW m −2 K −1 when the pitch was further increased to 3.0 mm. The observed differences in boiling performance for surfaces with the same spot size but different spot pitch at different heat flux regions can be attributed to different bubble interaction in relation to the distance between the nucleation regions.…”

“…Pool boiling is one of the most common processes for removing large amounts of heat and is continuously investigated in order to achieve performance breakthroughs in thermal management DOI: 10.1002/adfm.202310662 of nuclear power plants, [1,2] heat exchangers, [3,4] as well as highpower-density devices, such as microelectronics. [5,6] Boiling enables very efficient heat transfer due to high latent heat consumed by the phase change from the liquid to the vapor state.…”

“…[21,22] In recent years, various technologies have been explored to tailor the surface topography and morphology to improve boiling performance. [1,23] The fabrication of micro/nanostructures, e.g., cavities, pores, and irregularities on surfaces, can generally enhance bubble nucleation and rewetting with liquid, thus improving boiling performance. [24,25] For example, sintering, [26,27] electrochemical (electroplating) processes , [28] and chemical vapor deposition, [29] have been used to produce various coatings on surfaces in order to enhance performance of boiling heat transfer.…”