Abstract:As one approach of advanced packaging technologies, high reliability Liquid Mold UnderFill (Liquid MUF) materials and unique process will be presented here. Liquid MUF materials have the features of high adhesion, low CTE and low modulus. It is possible to alleviate the stress of the solder of each device mounted in the package, and they have excellent reliability too. These materials are adjusted the workability depending on the application. Moreover, because of low viscosity, the Liquid MUF material could be… Show more
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