Abstract:This paper focuses on packaging of thin film thermoelectric generators (TEG) for energy harvesting applications in sensor nodes for the internet of things (IoT). The TEGs have to be robust against mechanical stress caused by the assembly and packaging process steps and the mismatch of the coefficients of thermal expansion of the used materials. In this work, the mechanical stability of TEGs was evaluated by using a shear force test apparatus and a four line bending test. Furthermore the influence of underfill … Show more
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