Packaging of bio-MEMS: strategies, technologies, and applications

Velten, Thomas; Ruf, Hans Heinrich; Barrow, David A.; Aspragathos, Nikos Α.; Lazarou, P.; Jung, E.; Malek, Chantal Khan; Richter, M.; Kruckow, J.; Wackerle, M.

doi:10.1109/tadvp.2005.858427

Cited by 87 publications

(45 citation statements)

References 74 publications

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“…Many bonding techniques for plastic microfluidic chips have been demonstrated including thermal bonding/lamination [12,13], applying adhesive or UV-curable resin [14][15][16], solvent bonding [17][18][19][20][21], plasma-aided bonding [22], microwave welding [23], ultrasonic welding [24], resin-gas injection technique [25], and laminated film bonding [26]. An overview of the bonding techniques can also be found in the literature [27,28]. However, most of them are more or less problematic associated with channel deformation, contamination of solvent residue, tedious procedures, altering the original surface properties, being limited to the simple microchannel design, selection of specific materials, or creating heterogeneous surfaces inside microchannels.…”

Section: Introductionmentioning

confidence: 99%

Packaging of microfluidic chips via interstitial bonding technique

Lee

Juang

2008

Electrophoresis

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In this paper, we describe an interstitial bonding technique for packaging of microfluidic chips. The cover plate is first placed on top of the microfluidic chip, followed by dispensing the UV-curable resin into the resin-loading reservoirs. With the interstitial space between the cover plate and the microfluidic chip connecting to the loading reservoirs, the UV-curable resin wicks through capillary force action and hydrostatic pressure generated by the liquid level in the resin-loading reservoirs. When reaching the microchannels, the UV-curable resin stops flowing into the microchannels due to the force balance between the surface tension and hydrostatic pressure. The assembly is then placed under the UV light, followed by further curing in the thermal oven. It is found that there is no leakage from the bonded microfluidic chips and a good DNA separation result was obtained by using the microfluidic chips as fabricated. This bonding technique is relatively simple and fast, which can be applied to the packaging of microfluidic chips made from hybrid materials with complicated designs as long as the interstitial space connects to the loading reservoirs.

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Section: Introductionmentioning

confidence: 99%

Packaging of microfluidic chips via interstitial bonding technique

Lee

Juang

2008

Electrophoresis

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“…All the designs may not be able to fabricate with the required tolerance. The package also has to be designed along with the product design (O'Neal et al 1999;Velten et al 2005).…”

Section: Hierarchical Structure Of Mems Product Systemmentioning

confidence: 99%

Structural modelling and integrative analysis of microelectromechanical systems product using graph theoretic approach

Prince

Agrawal

2009

Microsyst Technol

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Micro-electromechanical systems (MEMS) as an enabling technology is seen to play a more and more important role for the main stream of industry of the future by broadening its applications to information, communications and bio technologies. Development of MEMS devices, however, still relies on knowledge and experience of MEMS experts due to the design and fabrication process complexity. It is difficult to understand the trade-offs inherent in the system and achieve an optimal structure without any MEMS-related insight. An attempt is made to develop an integrated systems model for the complete structure of the MEMS product system in terms of its constituents and interactions between the constituents. The hierarchical tree structures of the MEMS system and its subsystems are presented up to component level. For characterization, analysis and identification of MEMS product system, three different mathematical models say graph theoretic model, matrix model and permanent model are presented. These models are associated with graph theory, matrix method and variable permanent function by considering the various subsystems, subsubsystems up to component level, their connectivity and interdependency of the MEMS product system. The developed methodology is explained with an example. The proposed modeling and analysis is extendable to the subsystems and the component level. An overall structural analysis can be carried out by following a 'top-down' approach or 'bottom-up' approach. Understanding of MEMS product structure will help in the improvement of performance, cost, design time, and so on.

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“…Geralmente a cobertura e o substrato apresentam a mesma composição e as selagens são conduzidas a baixas temperaturas. Um dos métodos de selagem mais empregados é a térmica, na qual o substrato e a cobertura são pressionados e aquecidos em temperaturas próxi-mas à de fusão ou transição vítrea dos materiais 42 . O aquecimento pode ser realizado direta ou indiretamente empregando-se ultrasom, laser, microondas ou radiofreqüência.…”

Section: Selagem Dos Microdispositivos Fabricados Por Moldagemunclassified