Packaging of a high-speed optical modulator using flip chip interconnects

Abstract

Optical modulators using "Lithium Niobate" (LiNb03) have become the industry standard for high-speed data transmission and RF photonic links. Packaging is a determining factor in maintaining low cost and highperformance. This paper investigates the application of flip chip technology to optical modulator packaging. Experimental results show that rugged flip chip bonds can be realized with minimal impact on the modulator electrical performance.

Demonstration of a numerically optimized resonantly enhanced Mach-zehnder Modulator

“…To achieve this, high-inductive terminations should be realized, for example using spiral inductors. These could then be flip-chip interfaced to the modulator active region [10]. The same optimization approach can also be applied to the double-stub structure [4], [8] to optimize the electrode configuration.…”