Packaging Failure Isolation with Time-Domain Reflectometry (TDR) for Advanced BGA Packages

Yuan, Weiliang; Zhu, Wenliui; Win, Palei; Wang, C.K.; Tan, Henry; Sun, A.Y.S.

doi:10.1109/icept.2007.4441499

Cited by 15 publications

(4 citation statements)

References 6 publications

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“…Since the TDR instrument detects the sum of incident and reflected signal, the signal acquired at the open failure location is 2V in , and it is 0 at the short failure location [3].…”

Section: Setup and Methodologymentioning

confidence: 99%

Flip-chip package soft failure analysis and case studies using time domain reflectometry

Cao

Tran

Prabhu

et al. 2010

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

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This article describes how time domain reflectometry (TDR) enhances the capability of package-level fault isolation on resistive open, which is challenging using conventional methods, for flip-chip microprocessors. TDR successfully isolated the resistive open that caused functional failure; dual-beam focused ion beam (DB-FIB) confirmed TDR's isolation. Several cases studies for package/die failure isolation using TDR are also discussed.

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“…Since the TDR instrument detects the sum of incident and reflected signal, the signal acquired at the open failure location is 2V in , and it is 0 at the short failure location [3].…”

Section: Setup and Methodologymentioning

confidence: 99%

Flip-chip package soft failure analysis and case studies using time domain reflectometry

Cao

Tran

Prabhu

et al. 2010

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

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“…RF measurements technics are routinely used to assess the quality of cables, packages, PCB, and interconnects [10], [11], or to estimate parasitic elements [12]. Using Spread-Spectrum Time Domain Reflectometry (SSTDR), Furse, Kahn, et al [13] have been able to monitor the degradation of power electronics components and systems, including a discrete switching cell processing a low power.…”

Section: Introductionmentioning

confidence: 99%

Condition monitoring of power module using S-parameters, TDR, and TDT

Pascal

Daschner

Liserre

et al. 2022

Microelectronics Reliability

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“…Test methods based on a time domain reflectometry (TDR) have been proposed to test an assembled PCB circuit [4]- [7]. However, it is difficult to realize robust tests, since high-frequency measurement is requested in the tests.…”

Section: Introductionmentioning

confidence: 99%

A Built-in Test Circuit for Electrical Interconnect Testing of Open Defects in Assembled PCBs

Widiant

Hashizume

Suenaga

et al. 2016

IEICE Trans. Inf. & Syst.

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SUMMARYIn this paper, a built-in test circuit for an electrical interconnect test method is proposed to detect an open defect occurring at an interconnect between an IC and a printed circuit board. The test method is based on measuring the supply current of an inverter gate in the test circuit. A time-varying signal is provided to an interconnect as a test signal by the built-in test circuit. In this paper, the test circuit is evaluated by SPICE simulation and by experiments with a prototyping IC.

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Packaging Failure Isolation with Time-Domain Reflectometry (TDR) for Advanced BGA Packages

Cited by 15 publications

References 6 publications

Flip-chip package soft failure analysis and case studies using time domain reflectometry

Flip-chip package soft failure analysis and case studies using time domain reflectometry

Condition monitoring of power module using S-parameters, TDR, and TDT

A Built-in Test Circuit for Electrical Interconnect Testing of Open Defects in Assembled PCBs

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