Packaging Challenges for Miniaturized SOT Packages

Dexin, Zeng; Song, Hwangjun; Li, Yang; Tan, HB; Qianghua, Pan

doi:10.1109/iemt.2006.4456424

Cited by 2 publications

(1 citation statement)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Semiconductor technology and microelectronic industry have drastically changed the life style of human being since the discovery of transistor back in 1948. The new processes and performance capabilities surface out constantly [1] and with the increase demand for smaller, lighter and more functional electronic gadgets, the engineering capability and manufacturing robustness is the only way to survive [2].Generally, the semiconductor packaging process can be defined as the process of putting a semiconductor device or integrated circuit in a package of one form or another [3]. As integrated circuit feature size continues to shrink, yield loss due to parametric variation will become more and more significant [4].…”

Section: Introductionmentioning

confidence: 99%

Assessment on Copper C194 Mechanical Properties Variations in Typical Semiconductor Assembly Production Line

Amirul

Saad

Abdullah

2012

AMR

View full text Add to dashboard Cite

Process variation is inevitable for any production line regardless of the industry. The trend for smaller, lighter yet multifunctional devices has created high expectation for the semiconductor manufacturer to produce more robust and highly reliable devices. One way to achieve this is by assessing the variance performance of the assembly production. In this study, the mechanical properties of copper alloy C194 used as the lead frame for particular IC device have been investigated. Samples from control and defect groups been subjected to hardness (Rockwell test) and tensile (Instron test) while the optical microscopy used to verify the microstructure. The result shows that the hardness and tensile of the defect group is relatively lower than the control group while the elongation of the defect group is almost 10% higher. This finding is very useful to be shared with the process owner so that in-depth investigation on the lead frame material consistency or the temperature range optimization can be carried out to prevent such variations that contribute to the inconsistence wire bond yield performance.

show abstract

Section: Introductionmentioning

confidence: 99%