Package-Integrated, Wideband Power Dividing Networks and Antenna Arrays for 28-GHz 5G New Radio Bands

Ali, Muhammad; Watanabe, Atom O.; Lin, Tong‐Hong; Okamoto, Daichi; Pulugurtha, Markondeya Raj; Tentzeris, Manos M.; Tummala, Rao

doi:10.1109/tcpmt.2020.3013725

Cited by 22 publications

(9 citation statements)

References 34 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Compared with the previous works [7][8][9][10][11][12], the proposed antenna element has higher bandwidth of 21%.…”

Section: Comparison and Discussionmentioning

confidence: 80%

“…Antenna-in-Package (AiP) technology provides a mainstream solution for balancing cost, size, and performance in the millimeter-wave band [5,6]. A variety of materials can be adapted to AiP, such as low temperature cofired ceramic (LTCC) [7], glass substrate [8], stainless steel [9], and hydrocarbon ceramic organic based printed circuit board [10]. However, the cost of the above mentioned antennas is relatively high.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Miniature Bowtie Antenna Elements and Arrays Based on Ball Grid Array Packaging for 5g Millimeter-Wave Applications

Liu¹,

Zhang²,

Hao³

et al. 2021

PIER Letters

View full text Add to dashboard Cite

This letter proposes a miniature bow-tie antenna element and its 2 × 2 arrays based on ball grid array (BGA) packaging technology for 5G millimeter-wave new radio (NR) applications. The antenna substrate uses ultra-economical single-layer FR4 printed circuit boards (PCB) to reduce manufacturing costs. By adopting solder balls, the antenna achieves the BGA packaging and realizes the surface mounting function. One bow-tie patch is excited by a plated through-hole (PTH) connected to the feeding point. The other bow-tie patch is directly short connected to the ground plane by another PTH. Besides, the bottom ground plane can be equivalent to a reflector, allowing the antenna element and array to obtain broadside radiation. For ease of integration, the input impedance of the antenna is set to 50 Ω. The measurement results show that the −10 dB bandwidth of the antenna element is 21% covering 25.2 to 31.1 GHz. The measured peak gains of the antenna element and 2 × 2 arrays are 7.6 and 10.75 dBi, respectively. The proposed antenna element and array cover N257 (26.5-29.5 GHz) and N261 (27.5-28.35 GHz) bands. It is very suitable for the 5G millimeter-wave application.

show abstract

“…Compared with the previous works [7][8][9][10][11][12], the proposed antenna element has higher bandwidth of 21%.…”

Section: Comparison and Discussionmentioning

confidence: 80%

Section: Introductionmentioning

confidence: 99%

Miniature Bowtie Antenna Elements and Arrays Based on Ball Grid Array Packaging for 5g Millimeter-Wave Applications

Liu¹,

Zhang²,

Hao³

et al. 2021

PIER Letters

View full text Add to dashboard Cite

show abstract

“…3) GLASS PACKAGE Fig. 23 illustrates the cross-section of a glass-core based package that embeds an millimeter-wave chip inside a cavity [27], [57]. Low-loss thin film layers are deposited and patterned on both sides of the core layer to form an RDL with precision similar to that of a silicon back-of-the-line (BEOL) process.…”

Section: ) Wafer Level Packagementioning

confidence: 99%

“…Low-loss thin film layers are deposited and patterned on both sides of the core layer to form an RDL with precision similar to that of a silicon back-of-the-line (BEOL) process. Enabled by thru-glass vias (TGVs), millimeter-wave antennas and passive components such as power combiners and bandpass filters have been recently demonstrated [27]. Glass substrates also offer very good dimensional stability for large-panel processing which helps increase throughput and reduce manufacturing costs.…”

Section: ) Wafer Level Packagementioning

confidence: 99%

Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond

Liu

Sadhu

2021

IEEE J. Microw.

View full text Add to dashboard Cite

“…Benefiting from advanced packaging technology [9], surface-mount antennas can be easily integrated into the system package without any bulky connectors. Numerous studies have been carried out to improve the integration of antennas [10][11][12]. On the other hand, the differentially-fed antenna can obtain wide bandwidths, good radiation patterns, and low cross-polarization [13,14].…”

Section: Introductionmentioning

confidence: 99%

Broadband Surface-Mount Differential-Fed Dipole Antenna and Its Array for 5g Millimeter-Wave Applications

Liu¹,

Zhang²,

Hao³

et al. 2021

PIER Letters

View full text Add to dashboard Cite

This letter proposes a differentially-fed broadband dipole and its 1 × 8 array. The antenna achieves cost-effectiveness by using a low-cost FR4 substrate. The antenna obtains surface mount capability due to the ball grid array (BGA) package. The measured results show that the proposed antenna array achieves a wide impedance bandwidth of 37.8% (24-35.2 GHz). The gain of the 1 × 8 array is greater than 10.1 dBi, and the cross-polarization level in the main beam direction is less than −20 dB. The radiation pattern of the 1 × 8 array is stable and unidirectional. The proposed antenna array covers the 5G N257 (26.5-29.5 GHz), bands.

show abstract

Package-Integrated, Wideband Power Dividing Networks and Antenna Arrays for 28-GHz 5G New Radio Bands

Cited by 22 publications

References 34 publications

Miniature Bowtie Antenna Elements and Arrays Based on Ball Grid Array Packaging for 5g Millimeter-Wave Applications

Miniature Bowtie Antenna Elements and Arrays Based on Ball Grid Array Packaging for 5g Millimeter-Wave Applications

Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond

Broadband Surface-Mount Differential-Fed Dipole Antenna and Its Array for 5g Millimeter-Wave Applications

Contact Info

Product

Resources

About