Package and Process Design Augmentation of QFN Leadframe Device

Abstract

Innovations and breakthroughs either through process, equipment or material is known in semiconductor industries as a positive option in overcoming the existing limitations and assembly handicaps. This presentation discusses the assembly methodology and packaging design of a quad-flat no-leads (QFN) devices using grid design molding tool and leadframe with exposed copper tie bar. Realization of this improved package design proposed the removal of mechanical blade as the primary cutting technique of separating the molded leadframes likewise assembly rejection and defect related to the mechanical blade material together with the processing limitations is mitigated as well. Furthermore, the improved design is realized to be a better alternative for manufacturing tighter clearances and unit-unit pitching requirement thus supports densified and critical package design.