2023
DOI: 10.1002/sdtp.16821
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P‐122: Low Cross‐Linking Temperature Hole Transport Copolymer with Exemplary Hole Transport Ability for Efficient Solution‐Processed OLED

Thi Na Le,
Haechan Kim,
Ramachandran Elumalai
et al.

Abstract: Newly designed and synthesized hole transport material (HTM) composed of thermal cross‐linkable benzocyclobutene (BCB) [(7‐(2‐(4‐vinylbenzyl) oxy)ethoxy) bicyclo[4.2.0]octa‐1(6),2,4‐triene) and charge transport indenocarbazole (IC), having low cross‐ linking temperature of 130 °C and excellent charge transport ability (μh=1.01×10−2 cm2 V−1 s−1 at 4.0×105 Vcm−1 ), is reported in this work. Here, we also accurately predicted the cross‐linking temperature and calculated the charge transport parameters of the HTM … Show more

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