P.1.k.010 Influence of heavy metals on the Zangezur copper and molybdenum factory employees nervous system

Galstyan, L. G.; Manvelyan, H.M.

doi:10.1016/s0924-977x(15)30457-0

Cited by 1 publication

(3 citation statements)

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“…The TZM-HCS samples for all three conditions showed similar fractions of recrystallized grains, indicating that none of the conditions affected the microstructural aspects of the material, unlike that for Mo. Coefficient of thermal expansion for GaAs, CuMoCu, [52] Mo and TZM.…”

Section: Tzm Vs Mo As Exoskeleton In Hcsmentioning

confidence: 89%

“…Figure 12 shows the results of the CTE measurements for all conditions graphically, along with values for GaAs semiconductor and CuMoCu heat sink from the literature. [52] Figure 13 shows the results of the recrystallization fraction analysis and representative maps of TZM-HCS samples under the three conditions: AB, exposed to 1073 K (following CTE measurements), and exposed to 1373 K (after Cu infiltration). The TZM-HCS samples for all three conditions showed similar fractions of recrystallized grains, indicating that none of the conditions affected the microstructural aspects of the material, unlike that for Mo.…”

Section: Tzm Vs Mo As Exoskeleton In Hcsmentioning

confidence: 99%

“…The thermal diffusivities of both samples are within the upper limits of those reported for laminated heat sinks by manufacturers (45 to 65 Â 10 6 m 2 s À1 ). [52] The thermal diffusivities suggest that Mo-HCS þ Cu and TZM-HCS þ Cu would be excellent replacements for Cu-Mo-Cu in heat sink applications owing to the former structures' similar thermal diffusivity but superior thermal expansion. [53,54] In order to evaluate the superior performance of HCS structures compared to laminates, FEM simulations were performed.…”

Section: Thermal Diffusivity Measurementsmentioning

confidence: 99%

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Laser Powder Bed Fusion Additive Manufacturing of Mo and TZM Exoskeleton with Cu Infiltration for New Heat Sinks Configuration

Ramakrishnan,

Kumar,

Hudon

et al. 2023

Adv Eng Mater

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This study reports the fabrication and characterization of molybdenum (Mo) metal and titanium‐zirconium‐molybdenum (TZM) alloy exoskeletons with honeycomb cavity structures (HCS) that are infiltrated with oxygen‐free high conductivity (OFHC) Cu under an inert atmosphere as a potential replacement for Cu‐Mo‐Cu laminate in heat sink applications for power electronics semiconductors like GaAs. The thermal expansion behavior and the thermal loading of the starting Mo and TZM structures, and of the Cu‐infiltrated parts are evaluated. The fabricated Mo and TZM structures with density >99% and Mo‐based heat sinks with improved CTE (6.6 × 10−6 K−1) when compared to conventional Cu‐Mo‐Cu laminated heat sinks (CTE = 7.6 × 10−6 K−1). The new Mo and TZM structures promise superior performance due to their closer CTE to that of GaAs and similar semiconductors (CTE = 5.7 × 10−6 K−1). Exposure to temperatures up to 1073 K did not affect the Mo microstructure due to the inherent resistance to recrystallization, while exposure to 1373 K did reduce hardness. In contrast, TZM exoskeletons showed resistance to recrystallization even at 1373 K. The fabricated composite heat sinks showed thermal diffusivity (≈61 × 106 m2 s−1) that is within the upper limits of those reported for commercial laminated heat sinks (45 to 65 × 106 m2 s−1).

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Section: Tzm Vs Mo As Exoskeleton In Hcsmentioning

confidence: 89%

Section: Tzm Vs Mo As Exoskeleton In Hcsmentioning

confidence: 99%