Oxygen reduction on Au nanoparticle deposited boron-doped diamond films

Zhang, Yanrong; Asahina, Shunsuke; Yoshihara, Sachio; Shirakashi, Takashi

doi:10.1016/s0013-4686(02)00743-0

Cited by 107 publications

(96 citation statements)

References 21 publications

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“…[15][16][17] Amongst the preparation methods, electrochemical deposition is a fast, easy and convenient method for the preparation of AuNPs. 18,19 Two important factors that influence the catalytic behavior of AuNPs are size and crystallographic orientations. Electrodeposition of gold particles within the pores of porous alumina membranes represents attempts at reaching this aim by the electrodeposition technique.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical Deposition of Gold Nanoparticles on Pencil Graphite by Fast Scan Cyclic Voltammetry

Etesami

Karoonian

Mohamed

2011

J Chinese Chemical Soc

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Gold nanoparticles (AuNPs) were electrodeposited on the surface of pencil graphite (PG) by fast scan cyclic voltammetry without using any additives in acidic medium. The effect of deposition time on the size of electrodeposited AuNPs was investigated in sulfuric acid as a supporting electrolyte. The deposition time was varied by varying the scan rate, number of cycles and applied potential range. Scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray diffraction (XRD) were used for characterization of PG and electrodeposited AuNPs. The results confirmed that nanosized gold particles (20 ± 8 nm) were deposited on the PG substrate with almost spherical geometry.

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Section: Introductionmentioning

confidence: 99%

Electrochemical Deposition of Gold Nanoparticles on Pencil Graphite by Fast Scan Cyclic Voltammetry

Etesami

Karoonian

Mohamed

2011

J Chinese Chemical Soc

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“…[9][10][11][12] Moreover, the surface of gold can be easily utilized as a substrate or a linker for a biomolecular sensor application by attaching the end of a thiol group of probe molecules.…”

Section: Journal Of the Electrochemical Society 157 ͑1͒ D46-d49 ͑201mentioning

confidence: 99%

“…[8][9][10][11][12][13] Traditionally, Au ELP 14 on Al is preceded by the zincate process ͑Al → Zn → Ni → Au͒, which activates the Al surface. [15][16][17][18][19] The process involves the immersion of the Al substrate in a strong alkaline zincate solution.…”

mentioning

confidence: 99%

Electroless Gold Plating on Aluminum Patterned Chips for CMOS-Based Sensor Applications

Ko¹,

Koo

Kim³

et al. 2010

J. Electrochem. Soc.

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We presented an approach for the activation of aluminum ͑Al͒ alloy using palladium ͑Pd͒ and the subsequent gold ͑Au͒ electroless plating ͑ELP͒ for complementary metal oxide semiconductor ͑CMOS͒-based sensor applications. In this study, CMOS process compatible Al patterned chips were used as substrates for easy incorporation with existing CMOS circuits. To improve the contact resistance that arose from the Schottky barrier between the metal electrodes and the single-walled carbon nanotubes ͑SWCNTs͒, electroless deposition of gold that has a higher work function than Al was adopted because the SWCNTs has p-type semiconductor properties. Each step of the Au ELP procedure was studied under various bath temperatures, immersion times, and chemical concentrations. Fine Pd particles were homogeneously distributed on the Al surface by the Pd activation process at room temperature. Au ELP allowed selective deposition of the Au film on the activated Al surface only. The SWCNT networks formed on the Au plated chip by a dip-coating method showed improved contact resistance and resistance variation between the Au electrode and SWCNTs. We also tried SWCNT decoration with the Au particle using the upper Au ELP method, which was expected to be applied in various areas including field-effect transistors and sensor devices. Recently, the carbon nanotube ͑CNT͒ has been considered a promising candidate for a sensor material due to its high conductivity, small size, high mechanical strength, and stability in a harsh chemical environment.1-7 For these sensor materials to be a part of the commodity technology in the future, the integration of the nanomaterial with the complementary metal oxide semiconductor ͑CMOS͒ integrated circuit platform is indispensable for lower cost, reduced power consumption, and miniaturization. However, big technical challenges in the integration to CMOS chips are to acquire a reliable method of mounting the CNTs on required positions, and obtaining small contact resistance with aluminum ͑Al͒, which is used as a final metal pad for the conventional CMOS process. So, metal plating such as with gold ͑Au͒ is needed on top of the Al pad which forms the ohmic contact with CNTs.On the other hand, electroless plating ͑ELP͒ of noble metals on Al has been used in a variety of potential applications including flip-chip bonding of the CMOS chips on the printed circuit board, and protective coatings. [8][9][10][11][12][13] Traditionally, Au ELP 14 on Al is preceded by the zincate process ͑Al → Zn → Ni → Au͒, which activates the Al surface. [15][16][17][18][19] The process involves the immersion of the Al substrate in a strong alkaline zincate solution. This process consists of dissolution of a native Al oxide and the galvanic displacement reaction between zinc ͑Zn͒ ion and Al, and the formed Zn acts as a catalytic layer of the Au electroless deposition.The selective formation of Pd particles directly onto patterned Al substrates is a potential alternative in zincating processes used as intermediate layers in electrochemi...

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“…[7][8][9] Diante dessas vantagens, inúmeros trabalhos mostram resultados relevantes quanto à preparação, caracterização e aplicação de eletrodos de DDB modificados com NPs em eletroanálise. [10][11][12][13][14][15][16][17][18][19][20] Por exemplo, a deposição e codeposição de NPs-Pt sobre filmes de DDB tem sido um dos sistemas mais estudados devido ao interesse em eletrocatá-lise, particularmente, na eletro-oxidação de metanol. [13][14][15] Compósitos de DDB/NPs-Au preparados por diferentes técnicas apresentaram elevada atividade eletrocatalítica para a redução de oxigênio.…”

Section: Introductionunclassified

“…[13][14][15] Compósitos de DDB/NPs-Au preparados por diferentes técnicas apresentaram elevada atividade eletrocatalítica para a redução de oxigênio. [16][17][18] Mc Kenzie e Marken mostraram o poder catalítico de NPs de óxido de rutênio hidratado para a reação de evolução de hidrogênio. 19 Duo et al 20 reportaram a modificação de filmes de DDB com nanopartículas de IrO 2 usando a técnica de decomposição térmica e observaram uma modificação drástica do sobrepotencial de evolução de oxigê-nio, mostrando o poder eletrocatalítico para esta reação.…”

Section: Introductionunclassified

Influência do eletrólito na eletrodeposição de nanopartículas de Cu sobre eletrodo de diamante dopado com boro

Matsushima¹,

Santos²,

Couto³

et al. 2012

Quím. Nova

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Recebido em 21/9/10; aceito em 12/5/11; publicado na web em 4/7/11 ELECTROLYTE INFLUENCE ON THE Cu NANOPARTICLES ELECTRODEPOSITION ONTO BORON DOPED DIAMOND ELECTRODE. This paper presents the electrolyte influence on deposition and dissolution processes of Cu nanoparticles on boron doped diamond electrodes (BDD). Morphological, structural and electrochemical analysis showed BDD films with good reproducibility, quality and reversible in a specific redox system. Electrodeposition of Cu nanoparticles on DDB electrodes in three different solutions was influenced by pH and ionic strength of the electrolytic medium. Analyzing the process as function of the scan rate, it was verified a better efficiency in 0,5 mol L -1 Na 2 SO 4 solution. Under the influence of the pH and ionic strength, Cu nanoparticles on DDB may be obtained with different morphologies and it was important for defining the desired properties.Keywords: Cu nanoparticles; electrodeposition; boron doped diamond films. INTRODUÇÃONos últimos anos, o interesse por eletrodos modificados com nanopartículas (NPs) tem aumentado, consideravelmente, devido as suas propriedades físico-químicas bastante específicas que podem ser exibidas na escala nanométrica, mas que não são típicas dos materiais bulk correspondentes. 1 Na área eletroquími-ca, particularmente, em eletroanálise, NPs têm sido amplamente utilizadas como nanomatérias funcionais de superfície. Dentre alguns artigos excelentes de revisão publicados na literatura, [2][3][4][5][6] Welch e Compton destacam quatro principais vantagens quanto ao uso de eletrodos modificados com NPs aplicadas em eletroanálise: elevada área superficial efetiva, aumento do transporte de massa, atividade catalítica e controle sobre o microambiente local. 2 Em uma visão mais detalhada, a deposição de NPs resulta em um aumento da rugosidade superficial, que contribui para o aumento da área condutora do eletrodo modificado. Esta condição favorece a cinética de transferência de elétrons reduzindo o sobrepotencial para a ocorrência das reações eletroquímicas. Ao mesmo tempo, a redução do sobrepotencial aumenta a seletividade em uma análise eletroquímica, a qual permite a aplicação de potenciais de operação mais baixos, reduzindo ou mesmo eliminando a possibilidade dos potenciais de eletrólise de outras espécies presentes serem atingidos.Alguns metais, como platina, ouro e prata, têm sido comumente usados como NPs na modificação de eletrodos. Em razão da vasta aplicação eletroanalítica desses nanomateriais, outros metais, tais como paládio, rutênio, cobre e níquel vêm despertando interesse para tal propósito. 6 Entretanto, os resultados esperados são alcançados quando se tem um controle das características físico-químicas do substrato modificado. De forma geral, os substratos comumente usados para a caracterização eletroquímica de NPs estão sujeitos à corrosão (no caso do grafite e carbono vítreo) ou mesmo à formação de óxidos (no caso do titânio e ouro) em elevados potenciais anódi-cos. Estes acontecimentos podem modificar diretamente...

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Oxygen reduction on Au nanoparticle deposited boron-doped diamond films

Cited by 107 publications

References 21 publications

Electrochemical Deposition of Gold Nanoparticles on Pencil Graphite by Fast Scan Cyclic Voltammetry

Electrochemical Deposition of Gold Nanoparticles on Pencil Graphite by Fast Scan Cyclic Voltammetry

Electroless Gold Plating on Aluminum Patterned Chips for CMOS-Based Sensor Applications

Influência do eletrólito na eletrodeposição de nanopartículas de Cu sobre eletrodo de diamante dopado com boro

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