Abstract:In this, Part II of a two-part study, the oxidation kinetics in air of the ternary compounds Ti 2 AlC, Ti 2 AlC 0.5 N 0.5 , Ti 4 AlN 2.9, and Ti 3 AlC 2 are reported. For the first two compounds, in the 1000-1100°C temperature range and for short times ͑Ϸ20 h͒ the oxidation kinetics are parabolic. The parabolic rate constants are k x (m 2 /s) ϭ 2.68 ϫ 10 5 exp Ϫ 491.5 (kJ/mol)/RT for Ti 2 AlC, and 2.55 ϫ 10 5 exp Ϫ 458.7 (kJ/mol)/RT for Ti 2 AlC 0.5 N 0.5 . At 900°C, the kinetics are quasi-linear, and up to 10… Show more
“…Ti 2 AlC oxidation kinetics have been measured by various researchers [29][30][31]. Parabolic oxidation kinetics have been observed, which implies growth of the oxide scale is diffusion-controlled [26,[29][30][31].…”
Section: Diffusion Mechanism Of Microstructural Evolutionmentioning
confidence: 99%
“…Parabolic oxidation kinetics have been observed, which implies growth of the oxide scale is diffusion-controlled [26,[29][30][31]. In Ti 2 AlC, the oxide scale growth is caused by inward diffusion of O 2-and outward diffusion of Al 3+ and Ti 4+ [29][30][31].…”
Section: Diffusion Mechanism Of Microstructural Evolutionmentioning
Microstructural development during high-temperature oxidation of Ti 2 AlC below 1300 ºC involves gradual formation of an outer discontinuous TiO 2 layer and an inner dense and continuous α-Al 2 O 3 layer. After heating at 1400 ºC, an outer layer of mixed TiO 2 and Al 2 TiO 5 phases and a cracked α-Al 2 O 3 inner layer were formed. After heating to 1200 ºC and cooling to room temperature, two types of planar defect were identified in surface TiO 2 grains: twins with (2 0 0) twin plane and stacking faults bounded by partial dislocations. Formation of planar defects released thermal stresses that had generated in TiO 2 grains and arise from thermal expansion mismatch of the phases
“…Ti 2 AlC oxidation kinetics have been measured by various researchers [29][30][31]. Parabolic oxidation kinetics have been observed, which implies growth of the oxide scale is diffusion-controlled [26,[29][30][31].…”
Section: Diffusion Mechanism Of Microstructural Evolutionmentioning
confidence: 99%
“…Parabolic oxidation kinetics have been observed, which implies growth of the oxide scale is diffusion-controlled [26,[29][30][31]. In Ti 2 AlC, the oxide scale growth is caused by inward diffusion of O 2-and outward diffusion of Al 3+ and Ti 4+ [29][30][31].…”
Section: Diffusion Mechanism Of Microstructural Evolutionmentioning
Microstructural development during high-temperature oxidation of Ti 2 AlC below 1300 ºC involves gradual formation of an outer discontinuous TiO 2 layer and an inner dense and continuous α-Al 2 O 3 layer. After heating at 1400 ºC, an outer layer of mixed TiO 2 and Al 2 TiO 5 phases and a cracked α-Al 2 O 3 inner layer were formed. After heating to 1200 ºC and cooling to room temperature, two types of planar defect were identified in surface TiO 2 grains: twins with (2 0 0) twin plane and stacking faults bounded by partial dislocations. Formation of planar defects released thermal stresses that had generated in TiO 2 grains and arise from thermal expansion mismatch of the phases
“…Oxidation resistance is one of the critical properties of MAX phases for high temperature applications [16][17][18]. Wang et al [8,19] reported that the oxidation resistance of Al 2 O 3 -forming Ti 3 AlC 2 was superior to that of SiO 2 -forming Ti 3 SiC 2 .…”
Ti 2 AlC ternary carbide is being explored for various high temperature applications due to its strength at high temperatures, excellent thermal-shock resistance, and high electrical conductivity. A potential advantage of Ti 2 AlC over conventional Al 2 O 3 -forming materials is the near-identical coefficient of thermal expansion (CTE) of Ti 2 AlC and a-Al 2 O 3 , which could result in superior spallation resistance and make Ti 2 AlC a promising option for applications ranging from bondcoats for thermal barrier coatings to furnace heating elements. In this study,
“…The isothermal oxidation behavior of Ti 3 SiC 2 [2][3][4][5][6][7][8] and Ti 3 AlC 2 [9][10][11][12][13] has been extensively studied. The isothermal oxidation of Ti 3 SiC 2 at temperatures between 900 and 1200°C in air resulted in the formation of an outer TiO 2 layer, an intermediate SiO 2 -rich layer and an inner (TiO 2 ?…”
Dense, monolithic Ti 3 Al 0.7 Si 0.3 C 2 compounds were cyclically oxidized between 900 and 1100°C in air for 100 h. Ti 3 Al 0.7 Si 0.3 C 2 oxidized into rutileTiO 2 , a-Al 2 O 3 , and amorphous SiO 2 , accompanied by the evaporation of carbon. Ti 3 Al 0.7 Si 0.3 C 2 had good thermal shock resistance, so that adherent oxide scales formed, regardless of their thickness. The cyclic oxidation resistance of Ti 3 Al 0.7 Si 0.3 C 2 was poorer than that of Ti 3 SiC 2 , Ti 3 AlC 2 , and Cr 2 AlC. The thermal cycling did not affect the scale morphology or the oxidation mechanism that was identified in the isothermal oxidation tests, due mainly to the formation of the adherent oxide scales.
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