Oxidation of liquid solders for die attachment

Song, Jenn‐Ming; Cheng, Yun-Min; Tsai, Chi-Hang

doi:10.1016/j.corsci.2010.08.016

Cited by 8 publications

(5 citation statements)

References 15 publications

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“…The deconvoluted O 1s peaks are located at 530.6 (A) and 532.6 (B) eV for etch time of 0 s, corresponding to the spectral factoring of O chemically bound with metal element M and the adsorbed oxygen, respectively. Peak A might be assigned to the presence of metal oxide (OM oxide) [17]. Peak B has been reported to correspond to presentation of adsorbed oxygen [15].…”

Section: The Variation Of Atomic Concentration With Etch Timementioning

confidence: 99%

“…Based on the binding energies reported in previous studies in Table 1 and [15] 484.8 -SnO [15,19] 486.6/486 -530.1 SnO 2 [15,19] 486.4/487.1 531.0 Zn [20] 1 0 2 1 . 4 5 ZnO [20] 1021.7 530.7 Bi [10] 156.8 Bi 2 O 3 [10,17] 1 5 9 . 5 5 2 9 .…”

Section: Analyses For Sbzmentioning

confidence: 99%

“…And considering that O chemically bounded with Zn located at 530.7 eV, O bounded with Al located at 532.6 eV, the OM oxygen should be mainly ZnO and Al 2 O 3 with a little Bi and Sn inside. Peak B which corresponded to adsorbed oxygen (532.5 eV) [17] and Al 2 O 3 [19] that could not be resolved becomes lower and totally disappears after etching for 20 s. That is, the film of SBZA sample is much denser than the surface film of SBZ sample, because the time getting to zero for physical adsorbed oxygen in SBZ sample requires 60 s, 40 s more than SBZA sample.…”

Section: Analyses For Sbzamentioning

confidence: 99%

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XPS Depth Study on the Liquid Oxidation of Sn-Bi-Zn-X(Al/P) Alloy and the Effect of Al/P on the Film

Wang

Liu

Shi

et al. 2015

Advances in Materials Science and Engineering

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X-ray photoelectron spectroscopy (XPS) was used to study the properties of liquid oxidation of Sn-Bi-Zn (SBZ) solder alloys and the effect of Al/P on the oxide film. The results showed that the oxidation film on SBZ surface was in high concentration of both oxygen and zinc. Adding trace amount of Al/P to SBZ alloys (SBZA/ABZP) decreased the ratio of O/M (M could be Sn, Bi, and Al/P) and changed the film compositions. Layers near the free surface of oxidation film mostly contained Zn2+and Al3+oxides for SBZA. From the half quantitative analysis result, the aluminum had a surface enrichment behavior in liquid solder, so did phosphorus and zinc. Therefore, the Al/P addition changed their stoichiometry such as the ratio of O/M near film surface.

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Section: The Variation Of Atomic Concentration With Etch Timementioning

confidence: 99%

Section: Analyses For Sbzmentioning

confidence: 99%

Section: Analyses For Sbzamentioning

confidence: 99%

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XPS Depth Study on the Liquid Oxidation of Sn-Bi-Zn-X(Al/P) Alloy and the Effect of Al/P on the Film

Wang

Liu

Shi

et al. 2015

Advances in Materials Science and Engineering

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“…In the actual test, there are still serious oxidation phenomena during the preparation process and high-temperature use, which greatly affects the service life of the heat transfer fluid. In addition, oxidation resistance is the key to high-temperature performance of alloy, especially in an air environment [8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Effect of Ga on the Oxide Film Structure and Oxidation Resistance of Sn–Bi–Zn Alloys as Heat Transfer Fluids

et al. 2020

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The effect of gallium on the oxide film structure and overall oxidation resistance of low melting point Sn–Bi–Zn alloys was investigated under air atmosphere using thermogravimetric analyses. The liquid alloys studied had a Ga content of 1–7 wt.%. The results showed that the growth rates of the surface scale formed on the Sn–Bi–Zn–Ga alloys conformed to the parabolic law. The oxidation resistance of Sn–Bi–Zn alloys was improved by Ga addition and the activation energies increased from 12.05 kJ∙mol−1 to 22.20 kJ∙mol−1. The structure and elemental distribution of the oxide film surface and cross-section were found to become more complicated and denser with Ga addition. Further, the results of X-ray photoelectron spectroscopy and X-ray diffraction show that Ga elements accumulate on the surface of the liquid metal to form oxides, which significantly slowed the oxidation of the surface of the liquid alloy.

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“…inferior wetting abilities and entail narrower process windows, compared to that of conventional Sn-Pb solders [1,2]. The natural solderability degradation of Sn-based metal finishes on Cu substrate has been attributed to both surface Sn oxidation and interfacial Sn-Cu IMC growth, with the former dominant in early stages whilst the latter claimed to govern the eventual wettability loss [3].…”

mentioning

confidence: 99%

Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing

et al. 2018

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We report new insights into the solder wettability degradation of Sn thin films on Cu under 155°C isothermal ageing. A multiscale wettability degradation model was established, reflecting quantitatively the surface oxidation and interfacial intermetallic compound (IMC) growth, on the basis of solder wetting behaviour. The thermal oxidation of Sn exhibited heterogeneous inward thickening, lateral expanding and outward plateletlike growth, forming nanocrystalline, oxygen-deficient SnO2 with pronounced voiding/cracking propensity. Unlike a commonly held belief that the initial wettability loss is due to surface-exposing and oxidation of IMCs, it was found from dual combined effects of inward surface oxidation and outward IMC growth.

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Oxidation of liquid solders for die attachment

Cited by 8 publications

References 15 publications

XPS Depth Study on the Liquid Oxidation of Sn-Bi-Zn-X(Al/P) Alloy and the Effect of Al/P on the Film

XPS Depth Study on the Liquid Oxidation of Sn-Bi-Zn-X(Al/P) Alloy and the Effect of Al/P on the Film

Effect of Ga on the Oxide Film Structure and Oxidation Resistance of Sn–Bi–Zn Alloys as Heat Transfer Fluids

Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing

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