Overview of Interconnect—Copper and Low-k Integration

Dixit, G.; Havemann, R.H.

doi:10.1201/9781420017663-2

Cited by 2 publications

(2 citation statements)

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“…The state indifference is seen as damaging to the heritage value by experts. Dixit (2017), a noted historian in Nepal, remarks that “it is an unseemly fight that has delayed the restoration, and weakened the cultural aura that Kasthamandap sheds as the centre of Nepal Mandala, and a symbolism for the nation-state”. Dixit’s view may be discounted as being parochial; however, Western scholars have also viewed Kasthamandap as a landmark opportunity to resist any form of heritage subjugation.…”

Section: Local Resistance and Heritage Subjectivitiesmentioning

confidence: 99%

Geopolitical priorities, governance gaps, and heritage subjectivities: The perils of heritage-making in the post-disaster reconstruction in Nepal

Sengupta

2022

Environment and Planning C: Politics and Space

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Natural disasters are becoming more frequent around the world, causing extensive damage to both the physical and social fabric of cities and towns. Reconstruction of a city’s architecture and built heritage becomes a priority to safeguard lives, livelihoods, traditions, and cultures. The process, however, is replete with conflict and mediation between different tiers of governance resulting in a complex ‘heritagescape’. Drawing on the post-disaster reconstruction of Durbar Square, one of the seven World Heritage Sites in Kathmandu, Nepal, this paper demonstrates how heritage reconstruction sites serve as a stage for broadcasting geopolitical interests, national agendas, and subnational motives. Global actors and donor agencies appropriate heritage and legitimize their actions within the context of weak institutions, informal governance, and lack of formal plans and policies. This is resisted and re-worked by local groups through the cracks in the post-disaster reconstruction landscape. The paper draws on the fieldwork conducted between 2016-2019 supported by interviews with 47 individuals representing 13 organizations involved in the reconstruction. The paper demonstrates challenges in striking a balance to situate heritage on an international platform while also adhering to local sentiments and sensibilities. It also points to three intersecting planes of existence, emphasizing the simultaneous significance of global, national, and local dimensions and forces in post-disaster heritage-making.

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Section: Local Resistance and Heritage Subjectivitiesmentioning

confidence: 99%

Geopolitical priorities, governance gaps, and heritage subjectivities: The perils of heritage-making in the post-disaster reconstruction in Nepal

Sengupta

2022

Environment and Planning C: Politics and Space

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“…Additionally, higher electromigration reliability than Al by at least 10 times is another advantage for Cu as a conductor because Cu has a lower diffusivity than Al. Based on these reasons, semiconductor industries are fully transitioning toward using Cu instead of Al in future IC applications [12][13][14][15].…”

Section: Introductionmentioning

confidence: 99%

Copper Metal for Semiconductor Interconnects

Cheng¹,

Lee²,

Huang³

2018

Noble and Precious Metals - Properties, Nanoscale Effects and Applications

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Resistance-capacitance (RC) delay produced by the interconnects limits the speed of the integrated circuits from 0.25 mm technology node. Copper (Cu) had been used to replace aluminum (Al) as an interconnecting conductor in order to reduce the resistance. In this chapter, the deposition method of Cu films and the interconnect fabrication with Cu metallization are introduced. The resulting integration and reliability challenges are addressed as well.

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Overview of Interconnect—Copper and Low-k Integration

Cited by 2 publications

References 86 publications

Geopolitical priorities, governance gaps, and heritage subjectivities: The perils of heritage-making in the post-disaster reconstruction in Nepal

Geopolitical priorities, governance gaps, and heritage subjectivities: The perils of heritage-making in the post-disaster reconstruction in Nepal

Copper Metal for Semiconductor Interconnects

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