Out of plane motion of assembled microstructures using a single-mask SOI process

Subramaniam, V.; Pister, Kristofer S. J.

doi:10.1109/sensor.2005.1496509

Cited by 14 publications

(12 citation statements)

References 8 publications

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“…One significant problem faced during assembly with the method described in [9] is that only a top view is available while assembling the object. Since no information is available of the z-axis (except for knowing which parts are in the focal plane), it becomes difficult to know when you have lowered the gripper to the right height.…”

Section: Dual Chip Approachmentioning

confidence: 99%

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Methods and Characterization of Pick and Place Microassembly

Subramaniam

Pister

2006

Microelectromechanical Systems

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Microassembly of MEMS structures using serial pick-and place has been demonstrated as a method for constructing complex three-dimensional microstructures. A new methodology to perform pick-and-place microassembly using a 3 DOF micromanipulator is demonstrated here. In this approach, the "pick" operation is performed on one chip, while the "place" operation is performed on a second chip mounted orthogonally to it under a microscope. This removes the need for the rotation of parts during assembly as required in previous works thus creating a significantly simpler assembly process. Also new in this work is the characterization of the contact resistance and the rigidity of assembled microstructures. The contact resistance of assembled microparts coated with 30nm of gold is measured to be approximately 12Ωusing a four-point measurement. The force required to pull out a micropart from a socket (into which it is assembled) is characterized along all three axes and found to be over 5mN in each case. The relationship between the force taken to engage the sockets and the force to pull out a micropart is measured to be linear. An electrostatic inchworm motor with extended range and a vertical thermal actuator are demonstrated which are manufactured using microassembly. Thus this assembly process with mechanically rigid assemblies is shown to have a number of potential applications.

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Section: Dual Chip Approachmentioning

confidence: 99%

“…It should be noted that many of these applications are possible using the dual-chip approach suggested here or some of the methods previously reported in literature. These assemblies were performed using the orthogripper approach discussed in [9] since the dual chip approach was developed later.…”

Section: Applicationsmentioning

confidence: 99%

Methods and Characterization of Pick and Place Microassembly

Subramaniam

Pister

2006

Microelectromechanical Systems

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“…Other serial microassembly systems that make use of robotic micromanipulators are those equipped with microgrippers [11,22,23] or those equipped with microtweezers [15,20].…”

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confidence: 99%

Robotic Microassembly of 3D MEMS Structures

Gauthier

gnier²

2010

Robotic Microassembly

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“…They have been used for surfacemicromachined components to build 3-D structures from planar components [14], [15], but with components smaller than a millimeter, whereas the work reported in this paper uses centimeter-scale components. Planar snap fasteners have also been made [16], but they are also at a much smaller scale, and allow some wiggle between parts once they have been assembled.…”

mentioning

confidence: 99%

Precision In-Plane Hand Assembly of Bulk-Microfabricated Components for High-Voltage MEMS Arrays Applications

Gassend

Velásquez–García

Akinwande

2009

J. Microelectromech. Syst.

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This paper reports the design and experimental validation of an in-plane assembly method for centimeter-scale bulk-microfabricated components. The method uses mesoscaled deep-reactive-ion-etching (DRIE)-patterned cantilevers that deflect and lock into small v-shaped notches as a result of the hand-exerted rotation between the two components of the assembly. The assembly method is intended for MEMS arrays that necessitate a 3-D electrode structure because of their requirement for low leakage currents and high voltages. The advantages of the assembly method include the ability to decouple the process flow of the components, higher overall device yield, modularity, reassembly capability, and tolerance to differential thermal expansion. Both tapered and untapered cantilevers were studied.Modeling of the cantilever set shows that the springs provide low stiffness while the assembly process is in progress and high stiffness once the assembly is completed, which results in a robust assembly. In addition, analysis of the linearly tapered cantilever predicts that the optimal linearly tapered beam has a cantilever tip height equal to 37% of the cantilever base height, which results in more than a threefold increase in the clamping force for a given cantilever length and deflection, compared to the untapered case. The linear taper profile achieves 80% of the optimal nonlinear taper profile, which would be impractical to fabricate. Analysis of the experimental data reveals a biaxial assembly precision of 6.2-μm rms and a standard deviation of 0.6 μm for assembly repeatability. Electrical insulation was investigated using both thin-film coatings and insulating substrates. Leakage currents less than 1 nA at 2 kV were demonstrated. Finally, this paper provides selected experimental data of a gated MEMS electrospray array as an example of the application of the assembly method. Index Terms-Electrospray, high-voltage MEMS packaging, MEMS hand assembly.

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Out of plane motion of assembled microstructures using a single-mask SOI process

Cited by 14 publications

References 8 publications

Methods and Characterization of Pick and Place Microassembly

Methods and Characterization of Pick and Place Microassembly

Robotic Microassembly of 3D MEMS Structures

Precision In-Plane Hand Assembly of Bulk-Microfabricated Components for High-Voltage MEMS Arrays Applications

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