“…To maximize the performance of a vdW material-based device, good Ohmic contact between the metal electrode and semiconductor is fundamental. , The conventional method of improving the Ohmic contact for bulk or thin-film semiconductors involves ion implantation doping in the contact regions, which is challenging in ultrathin 2D materials. , Recently, edge contact, chemical doping, and charge transfer doping have been investigated to facilitate Ohmic contact formation between metals and 2D materials. ,,− Among them, the charge-transfer doping method is a simple, industry-compatible, and low-temperature process. Postannealing, which is the conventional method for contact improvement, is undesirable to 2D materials because their physical and electrical properties can be degraded. , …”