“…The stoichiometry, x, in a layer $600 nm thick was varied over the range 0.025 < x < 2.5 at.% by implanting Si or O over a range of energies to produce a layer with constant concentration, ±5%, of implanted ions in Type III silica samples [20]. This results in the generation, of a series of EPR-active centers in various intensities [21,22]. The concentrations of E 0 spins, peroxy radicals (POR), non-bridging oxygen hole centers (NBOHC) and a new EPR component, the OS center, were determined by double numerical integration of EPR spectra using a comparison technique involving a fixed Si:P standard sample [23].…”