2020 IEEE 3rd International Conference on Dielectrics (ICD) 2020
DOI: 10.1109/icd46958.2020.9341852
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Original design of field grading materials for high voltage power module applications

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Cited by 2 publications
(1 citation statement)
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“…Such values can get close to the partial discharge inception or even worse to the breakdown of the encapsulation. Therefore, over the last few years, efforts have been made in finding new solutions to reduce the local electric field at the triple points by tailoring the encapsulation through field grading approaches [3,4]. Among them, one consists to increase the dielectric permittivity of the encapsulation materials by adding high permittivity (high-k) particles [5], like BaTiO3.…”
Section: Introductionmentioning
confidence: 99%
“…Such values can get close to the partial discharge inception or even worse to the breakdown of the encapsulation. Therefore, over the last few years, efforts have been made in finding new solutions to reduce the local electric field at the triple points by tailoring the encapsulation through field grading approaches [3,4]. Among them, one consists to increase the dielectric permittivity of the encapsulation materials by adding high permittivity (high-k) particles [5], like BaTiO3.…”
Section: Introductionmentioning
confidence: 99%