Origami chip-on-sensor design: progress and new developments

Irmler, C.; Bergauer, T.; Frankenberger, A.; Friedl, M.; Gfall, I.; Ishikawa, A.; Kameswara, R; Kato, E.; Mohanty, G. B.; Negishi, K.; Onuki, Y.; Shimizu, Nobuhiro; Tsuboyama, T.; Valentan, Manfred

doi:10.1088/1748-0221/8/01/c01014

Cited by 13 publications

(8 citation statements)

References 4 publications

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“…The APV25 needs to be placed as close to the DSSD as possible to reduce the capacitive noise. This is done with the "origami" chip-on-sensor concept [6]. This novel design allows for the readout chips to be on a single side of the DSSD.…”

Section: Components Used For Svdmentioning

confidence: 99%

Construction and Quality Assurance of the Belle II Silicon Vertex Detector

Resmi¹,

Aihara²,

Aziz³

et al. 2019

Proceedings of the 27th International Workshop on Vertex Detectors — PoS(VERTEX2018)

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The Belle II experiment, which is situated at the interaction point of the SuperKEKB e + e − collider at KEK, Tsukuba, Japan, is expected to collect data corresponding to an integrated luminosity of 50 ab −1 . This data set will be sensitive to beyond-the-standard-model physics via precision measurements and searches for very rare decays. At its heart lies a six-layer vertex detector consisting of two layers of pixel detectors (PXD) and four layers of double-sided silicon microstrip detectors (SVD). Precise vertexing as provided by this device is essential for measurements of time-dependent CP violation. Crucial aspects of the SVD assembly are precise alignment, as well as rigorous electrical and geometrical quality assurance. We present an overview of the construction of the SVD, including the precision gluing of SVD component modules and the wire-bonding of various electrical components. We also discuss the electrical and geometrical quality assurance tests.

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Section: Components Used For Svdmentioning

confidence: 99%

Construction and Quality Assurance of the Belle II Silicon Vertex Detector

Resmi¹,

Aihara²,

Aziz³

et al. 2019

Proceedings of the 27th International Workshop on Vertex Detectors — PoS(VERTEX2018)

Self Cite

View full text Add to dashboard Cite

show abstract

“…The APV25 needs to be placed as close to DSSD as possible to reduce the capacitive noise. This is done with the "origami" chip-on-sensor concept [6]. This novel design allows for the readout chips to be on a single side of the DSSD.…”

Section: Components Used For Svdmentioning

confidence: 99%

Construction and quality assurance of the Belle II Silicon Vertex Detector

Resmi¹

2019

Preprint

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“…The Silicon Vertex Detector of the Belle II Experiment Antonio Paladino sensors have been thinned from the original 300 µm thickness down to 100 µm and placed on top of the sensors using the so called "Origami" chip-on-sensor concept [7] [8]. The Origami is a three layer kapton hybrid circuit on which all APV25 read-out chips of one sensor are placed and aligned.…”

Section: Pos(ichep2016)248mentioning

confidence: 99%

The Silicon Vertex Detector of the Belle II Experiment

Paladino¹,

Adamczyk²,

Aihara³

et al. 2017

Proceedings of 38th International Conference on High Energy Physics — PoS(ICHEP2016)

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The Belle II experiment at the SuperKEKB flavour factory will operate at an unprecedented luminosity of 8 × 10 35 cm −2 s −1 , which is about 40 times larger than its predecessor KEKB. The VerteX Detector is composed of a two-layer DEPFET PiXel Detector (PXD) and a four-layer double sided silicon strip detector (SVD). To achieve a precise vertex position determination and an excellent low-momentum tracking, even under the high background and high trigger rate of 10kHz, the SVD employs several innovative techniques. In order to reduce the occupancy and to minimise the parasitic capacitance in the signal path, 1748 APV25 ASIC chips, which read-out signals from 224k strip channels, are directly mounted on the ladders with the novel Origami concept. The analog signals from APV25 are digitised by an FADC system and sent to the central DAQ. An online tracking system based on SVD hits provides the Regions Of Interests to PXD in order to reduce the data size to achieve the required bandwidth and data storage space. In this talk, we present the design principles and construction status of the Belle II SVD, together with preliminary results on sensors performances.

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Origami chip-on-sensor design: progress and new developments

Cited by 13 publications

References 4 publications

Construction and Quality Assurance of the Belle II Silicon Vertex Detector

Construction and Quality Assurance of the Belle II Silicon Vertex Detector

Construction and quality assurance of the Belle II Silicon Vertex Detector

The Silicon Vertex Detector of the Belle II Experiment

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