1994
DOI: 10.1557/proc-338-589
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Organic Polymer Dielectrics in Microelectronic Technologies: Reliability Requirements, Testing, and Qualification

Abstract: This work reviews the dependence of reliability testing results on material processing and properties for polymeric materials used in high density interconnection technologies.Specific data are presented for CyclotenesTM 3022 resins containing divinylsiloxane bisbenzocyclobutene, (CAS 117732-87-3). Silane coupling agents discussed in this study are 3-aminopropyltriethoxysilane (CAS 01760-24-3)(APTES) and 3-methacryloxypropyl trimethoxysilane (CAS 02530-85-0) (MOP-TMS).

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