Organic contamination study for adhesion enhancement between final passivation surface and packaging molding compound

Alberici, S.; Dellafiore, A.; Manzo, Gabriel M.; Santospirito, G.; Villa, Claudio Maria; Zanotti, L.

doi:10.1016/j.mee.2004.07.040

Cited by 13 publications

(7 citation statements)

References 11 publications

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“…6 In addition, it was reported that hydrogen-argon plasma gas mixtures can effectively remove oxide from metallic substrates 7 and that oxygen plasma gas can decrease the surface energy of the polymers and improve the adhesion properties. 8 According to the previous study, 9 contact angle method has been used to observe not only the characterisation of plasma treatment but also the interfacial adhesion in electronic packaging.…”

Section: Introductionmentioning

confidence: 99%

Characterisation of FR-4 substrate with various plasma treatment conditions

Noh¹,

Jung²

2007

Materials Science and Technology

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The effects of plasma treatment on the surface of the flame resistant-4 (FR-4) substrate with underfills under various treatment conditions (operating gas, operating time, operating power) are investigated by using contact angle measurement, X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The plasma treatment on substrate surfaces increased the oxygen containing functional groups or the polar component of the surface free energy, improving the wetting characteristics of the underfills/FR-4 substrates. The plasma treatment conditions which minimised the contact angle between the underfills and FR-4 substrates were an operating power of 300 W and operating time of 180 s under Ar gas atmosphere.

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Section: Introductionmentioning

confidence: 99%

Characterisation of FR-4 substrate with various plasma treatment conditions

Noh¹,

Jung²

2007

Materials Science and Technology

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“…Future works could use the new die design to realize a robust die attach process and prevent any die attach related assembly issues. For references, works shared in [1][2][3][4][5] are helpful in tackling delamination issues. Studies and learnings discussed in [6][7][8][9][10][11][12] are useful to address other die attach related challenges.…”

Section: Discussionmentioning

confidence: 99%

Silicon Die with Integrated Epoxy for Improved Interface Adhesion

Gomez¹,

Rodriguez²

2021

JERR

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Breakthroughs and innovations are constantly being developed in electronic packaging industry to address the manufacturing challenges and overcome existing assembly limitations. An augmented design of thin Silicon die is introduced to establish a robust and improved interface adhesion between the die and the die attach material during the die attach process. The wafer preparation flow is also presented. The realization of the augmented die design with integrated epoxy material would ultimately provide a robust connection and would mitigate the die attach related issues such delamination, die cracks and voids.

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“…Few studies have been published in the literature [31][32][33][34]. The required level of cleanliness depends on the application for which the product is manufactured.…”

Section: Future Directionsmentioning

confidence: 99%