2009
DOI: 10.1016/j.surfcoat.2009.08.020
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Organic additive–copper(II) complexes as plating precursors

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Cited by 2 publications
(1 citation statement)
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“…This can be explained by a different coordination environment of Cu(II) in both the samples and points toward the existence of Cu–imidazole interaction in the nanosponges. The cyclic voltammogram recorded for the Cu@iNS solution agrees well with others described for copper electrodeposition and electrodissolution, in which the use of complexing reagents, such as oxalate, amine, and imidazole derivatives, are required …”
Section: Resultssupporting
confidence: 87%
“…This can be explained by a different coordination environment of Cu(II) in both the samples and points toward the existence of Cu–imidazole interaction in the nanosponges. The cyclic voltammogram recorded for the Cu@iNS solution agrees well with others described for copper electrodeposition and electrodissolution, in which the use of complexing reagents, such as oxalate, amine, and imidazole derivatives, are required …”
Section: Resultssupporting
confidence: 87%