2018
DOI: 10.1016/j.nanoen.2017.12.011
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Optogenetic control of body movements via flexible vertical light-emitting diodes on brain surface

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Cited by 71 publications
(38 citation statements)
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“…Packaging is another crucial technology to realize fully operational optoelectronic systems, enabling the interconnection of core and peripheral electronics . Various packaging methods such as wire, flip‐chip, and wafer bonding have been developed .…”
Section: Research Trends Of µLed Technologymentioning
confidence: 99%
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“…Packaging is another crucial technology to realize fully operational optoelectronic systems, enabling the interconnection of core and peripheral electronics . Various packaging methods such as wire, flip‐chip, and wafer bonding have been developed .…”
Section: Research Trends Of µLed Technologymentioning
confidence: 99%
“…Flexible µLEDs have been widely utilized in biomedical applications, including biosensors, healthcare devices, and optogenetic stimulators, due to its outstanding biocompatibility, low heating property, and excellent stability . Optogenetics is a promising cortical mapping technology, in which the microsized neural cells are stimulated using visible light for behavior control . Low heat from a photostimulator is essential to minimize brain tissue damage in optogenetic applications.…”
Section: Research Applications Of µLedsmentioning
confidence: 99%
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“…In particular, flexible memory is regarded as a vital component for high‐performance flexible electronics considering its fundamental functions in signal processing, data storage, and interdevice communication. Furthermore, a flexible artificial synapse can be employed in an implantable BMI, providing a valuable route to restore damaged neural functions such as vision, hearing, movement, and even complex cognitive behaviors …”
Section: Flexible Memristive Devicesmentioning
confidence: 99%
“…In addition, an ultrathin TFT and Si‐based large‐scale integration (LSI) were demonstrated for high‐density flexible electronics . Beyond the front‐end device level, flexible packaging has been developed to interconnect core and peripheral modules to realize fully operational system‐on‐plastic (SoP) …”
Section: Introductionmentioning
confidence: 99%