Optoelectronic packaging on flexible substrates using flip chip-based optodic bonding

Wang, Yixiao; Rother, Raimund; Overmeyer, Ludger; Müller, Claas

doi:10.1109/ectc.2015.7159768

2015 IEEE 65th Electronic Components and Technology Conference (ECTC) 2015

DOI: 10.1109/ectc.2015.7159768

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Optoelectronic packaging on flexible substrates using flip chip-based optodic bonding

Yixiao Wang

Raimund Rother

Ludger Overmeyer

et al.

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Optoelectronic packaging on flexible substrates using flip chip-based optodic bonding

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References 7 publications

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