Optimizing RF front ends for low power

Baltus, Peter; Dekker, R.

doi:10.1109/5.888994

Cited by 29 publications

(19 citation statements)

References 26 publications

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“…In [8] a double Lagrangian tool is proposed for this exercise, to solve the distribution of the gains and IP 3 for the cascade. Paper [7] summarizes [8] for M = 2. This Minimum Power Cascade Optimization (MPCO) solves:…”

Section: B Optimum Throughputmentioning

confidence: 99%

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Optimal transmission rate for ultra low-power receivers

Heuvel

Linnartz

Baltus

2010

21st Annual IEEE International Symposium on Personal, Indoor and Mobile Radio Communications

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Abstract-In many wireless systems, the energy consumed by the receiver is significantly larger than the energy consumed by transmitter, possibly even by orders of magnitudes. This paper derives an analytical solution to maximize the throughput per unit of available receiver circuit power. Adaptive control of the IP3, to handle the time-varying adjacent channel interference level, can substantially improve the power efficiency, compared to the common practice of design for worst case. There appears to be an optimum throughput at a specific (non zero) power consumption level. For large SNR, the optimal throughput per Joule of receiver circuit power occurs for a modulation rate of 2.3 bits/s/Hz, irrespective of interference power level. If the receiver has less power available than the optimum setting requires, a duty cycling scheme can still achieve optimum operation.

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Section: B Optimum Throughputmentioning

confidence: 99%

“…Most RF designs are based on a set of system specifications, determined by standardization [5], such specifications may include packet error rates, sensitivity and modulation. An RF designer than strives to design a receiver at the lowest power possible, for this target [6], [7].…”

Section: Introductionmentioning

confidence: 99%

Optimal transmission rate for ultra low-power receivers

Heuvel

Linnartz

Baltus

2010

21st Annual IEEE International Symposium on Personal, Indoor and Mobile Radio Communications

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“…Typically Nr = 4 → ND = 2. In practice, the RF preprocessors are coarsely quantized [5] and further corrupted by 5−7% …”

Section: Introductionmentioning

confidence: 99%

Optimal phase-shifter design to cancel RF interference in multi-antenna systems

Venkateswaran

Veen

2010

2010 IEEE International Conference on Acoustics, Speech and Signal Processing

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This paper introduces an analog preprocessing network (APN) operating in radio frequency (RF), to cancel signals from interferers in an antenna array system. Interference cancellation facilitates the use of low resolution ADCs. For a given ADC resolution, we will propose the optimal beamformer to minimize the overall mean squared error (MSE) between the desired user and its received estimate, while maximizing the desired signal to quantization noise ratio (SQNR). Subsequently, propose a matching pursuit design technique to represent the analytical APN transform as a linear combination of implementable phase shifters.

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“…But even for well-scaled active devices the rapid charging and decharging of capacitances contributes for a significant part to the total power consumption. These capacitances consist mainly of capacitances to ground, e.g., collector/drain to substrate, interconnect to substrate, or load to substrate [3], [4].…”

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confidence: 99%

Substrate transfer for RF technologies

Dekker

Baltus

Maas

2003

IEEE Trans. Electron Devices

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Abstract-The constant pressure on performance improvement in RF processes is aimed at higher frequencies, less power consumption, and a higher integration level of high quality passives with digital active devices. Although excellent for the fabrication of active devices, it is the silicon substrate as a carrier that is blocking breakthroughs. Since all devices on a silicon wafer have a capacitive coupling to the resistive substrate, this results in a dissipation of RF energy, poor quality passives, cross-talk, and injection of thermal noise. We have developed a low-cost wafer-scale post-processing technology for transferring circuits, fabricated with standard IC processing, to an alternative substrate, e.g., glass. This technique comprises the gluing of a fully processed wafer, top down, to an alternative carrier followed by either partial or complete removal of the original silicon substrate. This effectively removes the drawbacks of silicon as a circuit carrier and enables the integration of high-quality passive components and eliminates cross-talk between circuit parts. A considerable development effort has brought this technology to a production-ready level of maturity. Batch-to-batch production equipment is now available and the technology and know-how are being licensed. In this paper, we present four examples to demonstrate the versatility of substrate transfer for RF applications.

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Optimizing RF front ends for low power

Cited by 29 publications

References 26 publications

Optimal transmission rate for ultra low-power receivers

Optimal transmission rate for ultra low-power receivers

Optimal phase-shifter design to cancel RF interference in multi-antenna systems

Substrate transfer for RF technologies

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