Optimizing of the Colloidal Dispersity of Silica Nanoparticle Slurries for Chemical Mechanical Polishing

Zeng, Nengyuan; Zhao, Hongdong; Liu, Yuling; Wang, Chenwei; Luo, Chen; Wang, Wantang; Ma, Tengda

doi:10.1007/s12633-021-01448-y

Cited by 13 publications

(2 citation statements)

References 47 publications

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“…One of the main ways to modify the electrical conductivity of composites is resin matrix modification [ 26,27 ] (reducing resin resistivity by adding conductive fillers, nanomaterials, etc. ), however, this method requires consideration of the dispersion of the additions in the resin matrix, [ 28 ] and in addition some nanoparticles are expensive [ 29–31 ] and are not adapted to industrial applications.…”

Section: Introductionmentioning

confidence: 99%

Study on properties influence of carbon fiber reinforced polyimide composites via surface modification using metal mesh

et al. 2022

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In this work, carbon fiber reinforced polyimide (CF/PI) composites via surface modification using metal mesh were obtained. The interfacial adhesion performance of metal mesh and composites, mechanical properties and electrical properties of composites were characterized. The results revealed that introducing metal mesh on CF/PI composites surface obviously decreased the resistivity of composites, which was of great significance for lightning protection.For the mechanical properties, the short-beam shear strength and flexural properties of modified composites slightly declined, and the failure mode of samples did not change significantly. From microscopic failure morphology and finite element analysis, it can be illustrated that the crack generated from edge may lead to the mechanical properties changes of metal mesh modified sample. Based on practical application condition, the performance change rule of modified composite system after thermal treatment was also reported. This study enables a surface modification thought as a promising way for the application of high temperature resistant CF/PI composite system.

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Section: Introductionmentioning

confidence: 99%

Study on properties influence of carbon fiber reinforced polyimide composites via surface modification using metal mesh

et al. 2022

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“…[13][14][15][16] L. Zhang et al 17 studied the effect of pH value on the stability of the slurry, and the outcomes observed that superior slurry stability and good polishing results can be achieved under weak alkaline conditions. N. Zeng et al 18 investigated the effect of different pH values on the dispersibility of the slurry, and the results showed that the slurry had good dispersibility under pH 9.6 conditions. Through the research of many scholars, it is known that under weak alkaline conditions, the stability of the slurry can indeed be enhanced.…”

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confidence: 99%

Effect of Novel pH Regulators on Copper film Chemical Mechanical Polishing for Ruthenium-Based Copper Interconnect under Weak Alkalinity Conditions

Dong,

Niu,

Liu

et al. 2024

ECS J. Solid State Sci. Technol.

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For Ruthenium (Ru)-based copper (Cu) interconnects Cu film chemical mechanical polishing (CMP), it is crucial to select appropriate pH regulators in the slurry to ensure the chemical reactions and maintain the stability of the polishing chemical environment. In this study, the effects of inorganic pH regulator KOH, organic pH regulator diethanolamine (DEA), and 2-amino-2-methyl-1-propanol (AMP) on CMP and slurry properties of Cu film were compared. It was found when using AMP as a pH regulator, the Cu/Ru removal rate selectivity (RRS) can reach 598:1, the surface roughness of Cu film decreased to 0.76 nm, and the slurry can remain stable for at least 7 days. The performance order of the three pH regulators is AMP＞KOH＞DEA. Meanwhile, through experimental results and test analysis, it has been confirmed that AMP can also play a multifunctional role as a complexing agent, dispersant, and surfactant. Therefore, AMP can replace KOH as a new pH regulator in weak alkaline slurries. This result plays an important role in guiding the selection of organic pH regulators in the optimization of Cu film CMP slurry.

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Effect of dispersion performance of polishing slurry on the polishing quality of glass-ceramics in bonnet polishing

Shen

et al. 2023

Int J Adv Manuf Technol

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Optimizing of the Colloidal Dispersity of Silica Nanoparticle Slurries for Chemical Mechanical Polishing

Cited by 13 publications

References 47 publications

Study on properties influence of carbon fiber reinforced polyimide composites via surface modification using metal mesh

Study on properties influence of carbon fiber reinforced polyimide composites via surface modification using metal mesh

Effect of Novel pH Regulators on Copper film Chemical Mechanical Polishing for Ruthenium-Based Copper Interconnect under Weak Alkalinity Conditions

Effect of dispersion performance of polishing slurry on the polishing quality of glass-ceramics in bonnet polishing

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