Optimizing high-temperature capacitive energy storage performance by constructing crosslinked structure in self-crosslinkable polyetherimides

Zhu, Lixue; Zhou, Zheng; Xu, Wenhan; Tang, Yadong; Yao, Hongyan; Zhang, Yunhe; Jiang, Zhenhua

doi:10.1016/j.mtener.2022.101145

Cited by 8 publications

(4 citation statements)

References 39 publications

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“…Under high-temperature conditions, the energy loss in polymer dielectrics is primarily caused by the movement and relaxation of molecular segments. 29 In the case of PEI and PES mixtures, the nearly linear PES molecular chains are entwined around the curly PEI molecular chains, and the interaction of phenyl groups with different electrical properties helps to inhibit high-temperature relaxation behavior and carrier transport. Notably, the current density of the 9 : 1 and 8 : 2 composites is remarkably lower than those of pristine PEI and PES, and similarly, the 9 : 1 and 8 : 2 composites exhibit the lowest conductivity (Fig.…”

Section: Resultsmentioning

confidence: 99%

Achieving synergistic improvement in dielectric and energy storage properties at high-temperature of all-organic composites via physical electrostatic effect

Shang,

Feng,

Meng

et al. 2024

Mater. Horiz.

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Section: Resultsmentioning

confidence: 99%

Achieving synergistic improvement in dielectric and energy storage properties at high-temperature of all-organic composites via physical electrostatic effect

Shang,

Feng,

Meng

et al. 2024

Mater. Horiz.

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“…The balance between the degree of crosslinking and the dielectric properties of the polymer is critical since crosslinking has the same effect on permittivity and dielectric loss. In experiments, as the degree of crosslinking increases, a simultaneous decrease in permittivity and dielectric loss is usually observed [110, 111]. This runs counter to the hopes of achieving low dielectric loss while maintaining a high permittivity constant, necessitating researchers to master the delicate equilibrium between cross‐linking and dielectric properties, contingent on the prevailing application scenario.…”

Section: Dipolar Polymersmentioning

confidence: 99%

Research progress of intrinsic polymer dielectrics with high permittivity

Chen

Liu

Zheng

et al. 2023

IET Nanodielectrics

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The high permittivity of polymer dielectrics facilitates their use in the electronics industry. Compared to inorganic ceramics and composites, intrinsic high permittivity polymer dielectrics have the advantages of easy solution processing and better homogeneity. The permittivity of common polymers is generally low, hence it would be worthwhile to explore avenues for augmenting the permittivity of polymer dielectrics via judicious and efficient structural design. The effective strategies used to increase the permittivity of intrinsic polymers encompass elevating local polarisabilities by fortifying electron delocalisation capabilities, exploiting ion pairs to generate atomic clusters with larger dipole moments, amplifying dipole density, augmenting dipole mobility, and so forth. Due to the rigidity and flexibility of the polymer backbone's decisive influence on the dielectric's all‐around performance, its selection also requires a total consideration of the requirements of practical applications. This work provides an overview and a brief evaluation of the dominant design strategies and mentions possible future design paradigms for polymer dielectrics.

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“…Delightfully, the 𝜂 remains above 90% and exceeds that of pure PEI at the same electric. Hence, it is quite remarkable that the U d and 𝜂 of PMHT/PEI films are higher than that of many linear polymer dielectrics, [27,30,[47][48][49][50][51][52][53][54] depicted in Figure 11d.…”

Section: Energy Storage Properties Of Polymer Filmsmentioning

confidence: 99%

Improved Capacitive Energy Storage at High Temperature via Constructing Physical Cross‐Link and Electron–Hole Pairs Based on P‐Type Semiconductive Polymer Filler

Yan,

Wan,

Long

et al. 2023

Adv Funct Materials

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In this work, p‐type polymer semiconductor poly(2‐((3,6,7,10,11‐pentakis (hexyloxy) triphenylene‐2‐yl)oxy)ethyl methacrylate) (PMHT) is added into polyetherimide (PEI). Benefiting from the electrostatic interaction between strong electrophilic charged phenyls of the PEI matrix and strong electronegative benzophenanthrene unit of the PMHT filler, the physical cross‐linked networks are formed in polymer blends. Meanwhile, the lowest unoccupied molecular orbital level of PEI is close to the highest occupied molecular orbital level of PMHT, which is easy to establish electron–hole pair by Coulomb force. Thus, the carrier trap is constructed in the heterojunction region between PMHT filler and PEI matrix. Both physically cross‐linked networks and electron–hole pairs can promote breakdown strength (Eb) of PEI and decrease energy loss. Importantly, PMHT filler can improve the dielectric constant of PEI. As a result, 0.75 wt% PMHT/PEI delivers an ultrahigh discharge energy density (Ud) of 10.7 J cm−3 at an Eb of 680 MV m−1 and at room temperature, and maintains a charge and discharge efficiency of above 90%. In addition, a superior Ud of 5.1 and 3.3 J cm−3 is achieved at 150 and 200 °C, respectively. This paper creates a new perspective for preparing high‐properties polymer dielectrics by combining the advantages of cross‐linking and electron–hole pairs.

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Optimizing high-temperature capacitive energy storage performance by constructing crosslinked structure in self-crosslinkable polyetherimides

Cited by 8 publications

References 39 publications

Achieving synergistic improvement in dielectric and energy storage properties at high-temperature of all-organic composites via physical electrostatic effect

Achieving synergistic improvement in dielectric and energy storage properties at high-temperature of all-organic composites via physical electrostatic effect

Research progress of intrinsic polymer dielectrics with high permittivity

Improved Capacitive Energy Storage at High Temperature via Constructing Physical Cross‐Link and Electron–Hole Pairs Based on P‐Type Semiconductive Polymer Filler

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